Tallysman Wireless is announcing that it has added the housed TW3885T dual-band (L1/L5) Accutenna technology, and timing antenna to its industry-leading line of GNSS products. The dual-band TW3885T antenna supports GPS/QZSS L1/L5, Galileo E1/ E5a/b, BeiDou B1/B2/B2a, GLONASS G1/G3, and in the region of operation, satellite-based augmentation systems (SBAS): [WAAS (North America), EGNOS (Europe), MSAS […]
Applications
Magnetic sensors optimized for ADAS applications
Allegro MicroSystems, Inc. announced the launch of its A33110 and A33115 magnetic position sensors at the Sensors Converge Conference in San Jose, CA. Designed for advanced driver assistance systems (ADAS) applications that require high levels of accuracy and heterogeneous signal redundancy, Allegro’s newest sensors combine the company’s vertical Hall technology (VHT) with cutting-edge tunneling magnetoresistance (TMR) technology in […]
BLE MCUs target economical applications
Texas Instruments expanded its connectivity portfolio with a new family of wireless microcontrollers (MCU) that enable high-quality Bluetooth Low Energy (LE) at half the price of competing devices. Featuring best-in-class standby current and radio-frequency (RF) performance, the SimpleLink Bluetooth LE CC2340 family is built on the foundation of TI’s decades of wireless connectivity expertise. Pricing […]
Temperature, humidity sensors/signal conditioners target IoT apps
Renesas Electronics Corporation is changing the way designers build sensor-connected IoT applications with a range of new solutions targeted at faster design cycles, improved accuracy, and reduced system cost. In addition to the new HS4XXX family of relative humidity and temperature sensors, Renesas is introducing the ZSSC3281 sensor signal conditioning (SSC) IC for highly accurate amplification, digitization, and sensor-specific […]
Ultra-low-noise barometric pressure sensors target smart home appliance apps
TDK Corporation announces that the InvenSense ICP-20100, the latest generation of the SmartPressure MEMS Barometric Pressure Sensors, is now in mass production and has been certified by NextNav. Launched in 2021, the NextNav Certified process independently verifies the InvenSense sensor accuracy measurements, by engaging directly with component manufacturers to rigorously test sensors in real-world operating […]
Wireless IP adds digital key capability to automotive ICs
CEVA, Inc. announced that its RivieraWaves ultra-wideband (UWB) IP has been extended with the RW-UWB-CCC MAC software package to support the Car Connectivity Consortium (CCC) Digital Key 3.0 specification. Already licensed to one of the largest players in the automotive semiconductor industry for their digital key product line, CEVA’s Digital Key 3.0 compliant UWB IP allows chip vendors…
Wi-Fi 7 front-end modules target automotive, IoT apps
New RFFE modules are designed for Bluetooth, Wi-Fi 6E, and the next-generation standard, Wi-Fi 7. The modules are designed for a wide array of device segments beyond smartphones – including automotive, XR, PCs, wearables, mobile broadband, IoT, and more. “With Qualcomm Technologies’ new products, we are extending our RFFE leadership into automotive and IoT, helping […]
How can EMI be eliminated from an industrial cable system?
Electromagnetic interference, or EMI, is an unfortunate fact of life in industrial environments due to the wide variety of equipment and devices operating in close proximity. Every piece of electric or electronic equipment generates signals that can interfere with other nearby machinery, potentially causing suboptimal performance or even total failure. And while the idea of […]
BLE SOC incorporates PMU, VAD, and GPU
Renesas Electronics Corporation announced the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions ― the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity. The DA1470x Family is the only solution in the Bluetooth LE space to integrate a power management unit, a hardware voice activity detector (VAD), a Graphics Processing Unit (GPU), and Bluetooth LE connectivity into […]
SO 26262, ASIL‑B PMICs handle automotive camera modules
ROHM Semiconductor announced the availability of ISO 26262 and ASIL-B-compliant PMICs, BD868xxMUF-C (BD868C0MUF-C, BD868D0MUF-C), for automotive camera modules, which are increasingly being adopted in advanced driver-assistance systems (ADAS). The continuing evolution of ADAS in recent years has increased the number of onboard cameras. At the same time, introducing the concept of functional safety is taking on […]