Toshiba America Electronic Components, Inc. (TAEC)* today announced that it has introduced a new lineup of multi-bit, low-capacitance electrostatic discharge (ESD) protection diodes for high-speed interfaces. Suitable for use in mobile devices, including smart phones, tablets, and wearable devices, the new diodes deliver excellent protection performance and support interfaces including USB 3.0/3.1 and HDMI. The new […]
Hirose has developed a compact flexible printed circuit (FPC) connector that offers a super low-profile of only 0.5 mm with a space-saving 0.25-mm pitch and depth of only 3.15 mm when locked. The FH64MA Series contributes to profile reduction in a variety of portable and consumer devices including active trackers, electronic labelers, laptops/tablets, portable audio […]
Hirose ,has developed a compact flexible printed circuit (FPC) connector that offers a super low-profile of only 0.5mm with a space-saving 0.25mm pitch and depth of only 3.15mm when locked. The FH64MA Series contributes to profile reduction in a variety of portable and consumer devices including active trackers, electronic labelers, laptops/tablets, portable audio players, portable gaming […]
Qualcomm Incorporated announced at MWC Shanghai that its subsidiary, Qualcomm Technologies, Inc., is bringing LTE categories M1 (eMTC) and NB1 (NB-IoT) connectivity to the wearables industry with the launch of the new Qualcomm Snapdragon Wear 1200 platform. Snapdragon Wear 1200 takes advantage of the wide coverage provided by emerging LTE narrowband technologies, or LTE IoT, to help […]
Murata Americas today introduced the PJFV series. This miniaturized, low power consuming product leverages piezoelectric ceramics to provide vibration notifications and announcements to wearable devices. It measures just 10.5mm ´ 3.8mm ´ 2mm, has a rated working voltage of 3V, and current consumption of 2mA rms. Light and sound sensing products have historically been used for notification and announcement functions. With the roll-out of the PJFV series, now vibration solutions can […]
Silego Technology Inc. announces the introduction of SLG46580, further expanding the GreenPAK (GPAK) family of Programmable Mixed-signal Integrated Circuits (CMICs). This newest GPAK is targeted to support power systems in wearable and handheld market segments. This device is both highly integrated and highly flexible, and can provide a rich set of features, including voltage monitoring, […]
MediaTek Inc. today introduced the world’s first 4×4 802.11n and Bluetooth 5.0 system-on-chip featuring a dedicated Wi-Fi network accelerator. The MediaTek MT7622 was created for premium networking devices including routers and repeaters, whole home Wi-Fi, and home automation gateways that pre-integrates audio and storage features. With versatility at the core of its design, the MT7622 […]
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Charging — let alone recharging — a wearable is a significant challenge. Conventional recharging technologies don’t necessarily translate well to a piece of clothing that will literally go through the ringer in terms of stretching. But now Nanoengineers at the University of California San Diego have developed the first printed battery that is flexible, stretchable and […]
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The SAM R30 System in Package (SiP), a single-chip RF microcontroller (MCU), is now available from Microchip Technology Inc. (MCHP). The SAM R30 SiP incorporates an ultra-low power microcontroller with an 802.15.4 sub-GHz radio, providing multi-year battery life in a compact 5 mm package. The SAM R30 SiP delivers design flexibility and proven reliability all […]
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Easier, faster, cheaper — three keywords associated with meeting aggressive time-to-market demands, particularly in the evolving electronics design world. And a critical component of meeting those demands is producing a prototype that does not involve complicated processes, is rapidly manufactured, and does not cost a fortune for low-volume orders. In other words, “easier, faster, cheaper.” […]