Researchers at Purdue University have demonstrated an experimental transistor made from a beta gallium oxide semiconductor. The transistor — called a gallium-oxide-on-insulator field effect transistor, or GOOI FET — is interesting thanks to the ultra-wide bandgap inherent in gallium oxide. Beta gallium oxide (ß-Ga2O3) has a bandgap of 4.8 – 4.9 eV. In comparison, gallium […]
Mentor Graphics Corp. today announced that TSMC has extended its collaboration with Mentor Graphics on the Xpedition® Enterprise platform in conjunction with the Calibre® platform for the design and verification of TSMC’s InFO (Integrated Fan-Out) packaging technology for multi-chip and chip-DRAM integration applications. Mentor developed new Xpedition functionality specifically to support InFO and enable the […]
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Mill-Max is adding to its diverse mix of press-fit pins with six new offerings designed for applications where mechanical strength and/or power delivery are essential. These new PCB pins feature multi-faceted (polygon) geometries and are suitable for solderless PCB termination or for direct soldering to the board for those situations requiring it. When these pins […]
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The Consortium for On Board Optics, called COBO, is developing new inside-the-box standards for onboard optical interconnects first for inside high-speed datacenters. The primary driving elements of this type of packaging and connectivity is power/cooling costs savings and port count density versus the traditional pluggable module and AOC approaches. Their first application is being driven […]
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Interconnects, though often simple components, can be confusing to many engineers, who don’t study in-depth these critical components that help safely join machinery, cables and boards together. Not surprisingly, our readers turn to our “Connector Basics” section to find answers to some of their most common questions on how to select the right product for […]
Valencell, the leading innovator in performance biometric data sensor technology, and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced today the launch of a new, highly accurate and scalable development kit for biometric wearables that includes ST’s compact SensorTile turnkey multi-sensor module integrated with Valencell’s Benchmark™ biometric sensor […]
Farnell element14, The Development Distributor, is launching a new global competition to discover how engineers can ‘Change the World’ with their design ideas. The aim of the competition is to find out how the world of electronics can have a positive impact on the world we live in by challenging designers to come up with creative […]
Fairview Microwave Inc., a supplier of on-demand microwave and RF components, now offers small form factor MMBX connectors and adapters most commonly used on circuit boards and their associated input/output connections for industrial, telecom and consumer product applications. MMBX-style connectors and adapters are specifically designed to provide versatile and easy PCB-to-PCB connections as well as […]
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Two of the largest manufacturers of high-speed I/O and backplane manufacturers, Molex and TE Connectivity today announced that they have formed a Dual Source Alliance (DSA) agreement to each produce a new generation of high-speed input/output (I/O) and backplane connectors, and cable assemblies for data communications applications. Molex and TE will collaborate on the launch […]
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Chip maker NXP is putting on a one-day seminar in various cities, covering Bluetooth and Thread wireless technology. We sat in on the seminar held at Arrow Electronics in the Cleveland, Ohio area. Here are some of the highlights of that experience.