• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar
  • Skip to footer

Electrical Engineering News and Products

Electronics Engineering Resources, Articles, Forums, Tear Down Videos and Technical Electronics How-To's

  • Products / Components
    • Analog ICs
    • Battery Power
    • Connectors
    • Microcontrollers
    • Power Electronics
    • Sensors
    • Test and Measurement
    • Wire / Cable
  • Applications
    • 5G
    • Automotive/Transportation
    • EV Engineering
    • Industrial
    • IoT
    • Medical
    • Telecommunications
    • Wearables
    • Wireless
  • Learn
    • eBooks / Handbooks
    • EE Training Days
    • Tutorials
    • Learning Center
    • Tech Toolboxes
    • Webinars & Digital Events
  • Resources
    • White Papers
    • Design Guide Library
    • Digital Issues
    • Engineering Diversity & Inclusion
    • LEAP Awards
    • Podcasts
    • DesignFast
  • Videos
    • EE Videos and Interviews
    • Teardown Videos
  • EE Forums
    • EDABoard.com
    • Electro-Tech-Online.com
  • Bill’s Blogs
  • Advertise
  • Subscribe

200 μm vapor chamber claimed to be the world’s thinnest heat dissipator for electronic devices

May 25, 2021 By Redding Traiger Leave a Comment

Murata Manufacturing Co., Ltd. and Cooler Master Co., Ltd. have jointly developed a 200 μm vapor chamber, the world’s thinnest heat dissipator for electronic devices. This is the first product to result from the joint development partnership between Murata, which brings expertise in designing compact electronic components, and Cooler Master, a leader in heat dissipators for electronic devices. Both companies are committed to strengthening their partnership moving forward as they work to create new products that solve heat-related problems affecting next-generation devices.

As electronic devices achieve higher performance and more advanced functionality, the amount of heat generated per device is increasing, making efficient heat dispersion and dissipation, as well as cooling, a key issue. In addition, the limited available space inside the product case of high-density designs means that conventional heat dispersion components such as graphite sheets and heat pipes cannot provide sufficient heat dissipation. This has created a need for vapor chambers, which can disperse heat over a large surface area and dissipate heat effectively in spite of limited space. The space available for heat dissipators is particularly limited in mobile products with advanced functionality, such as 5G smartphones and AR and VR devices, as they utilize high-performance ICs and face constant demand for reduced weight.

Using Murata’s technology and expertise in electronic components, mainly for communication applications, the new product was designed to be the world’s thinnest vapor chamber at only 200 μm thick. It can be mounted in very small interior spaces yet provides efficient dispersion and dissipation of heat from components such as ICs, thereby improving the operating stability of compact electronic devices. The 200 μm vapor chamber will be manufactured at Cooler Master’s factory, benefiting from their extensive expertise in producing heat dissipators for a variety of electronic devices, and will be widely marketed as a product bearing the Cooler Master brand.

A cooling liquid (operating fluid) is enclosed between overlapping layers of thin metal foil. The operating fluid absorbs heat from the heat source, causing it to evaporate, and this vapor is dispersed within the vapor chamber, dissipating the heat. As the heat is dissipated, the vapor recondenses into the liquid to be circulated back to the heat source via a wick containing minute gaps.

Beginning with this new product, Murata and Cooler Master intend to build a partnership to meet new technical challenges and a wide range of product needs by utilizing expertise from both companies to develop heat dissipators for electronic devices. To strengthen cooperation between the companies on product development, Cooler Master plans to install development and testing facilities with the same conditions as Murata’s facilities at Cooler Master headquarters building scheduled for completion in the second half of 2021. This will allow the partners to share new product concepts and ideas without delay and realize the development of a system that provides accurate performance evaluation.

You Might Also Like

Filed Under: 5G, Applications, Consumer, IoT, Tools Tagged With: coolermasterco, muratamanufacturingco

Reader Interactions

Leave a Reply Cancel reply

You must be logged in to post a comment.

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Primary Sidebar

EE Engineering Training Days

engineering

Featured Contributions

Five challenges for developing next-generation ADAS and autonomous vehicles

Robust design for Variable Frequency Drives and starters

Meeting demand for hidden wearables via Schottky rectifiers

GaN reliability milestones break through the silicon ceiling

From extreme to mainstream: how industrial connectors are evolving to meet today’s harsh demands

More Featured Contributions

EE Tech Toolbox

“ee
Tech Toolbox: Internet of Things
Explore practical strategies for minimizing attack surfaces, managing memory efficiently, and securing firmware. Download now to ensure your IoT implementations remain secure, efficient, and future-ready.

EE Learning Center

EE Learning Center
“ee
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.
“bills

R&D World Podcasts

R&D 100 Episode 10
See More >

Sponsored Content

Advanced Embedded Systems Debug with Jitter and Real-Time Eye Analysis

Connectors Enabling the Evolution of AR/VR/MR Devices

Award-Winning Thermal Management for 5G Designs

Making Rugged and Reliable Connections

Omron’s systematic approach to a better PCB connector

Looking for an Excellent Resource on RF & Microwave Power Measurements? Read This eBook

More Sponsored Content >>

RSS Current EDABoard.com discussions

  • Will this TL084C based current clamp circuit work?
  • Mains inverter with switching node going out on the mains cable!?
  • ISL8117 buck converter blowing up
  • MOSFET thermal noise in Weak vs Strong inversion
  • System verilog constraint error

RSS Current Electro-Tech-Online.com Discussions

  • Kawai KDP 80 Electronic Piano Dead
  • My Advanced Realistic Humanoid Robots Project
  • FSK SER on the same symbols
  • Wideband matching an electrically short bowtie antenna; 50 ohm, 434 MHz
  • using a RTC in SF basic
Search Millions of Parts from Thousands of Suppliers.

Search Now!
design fast globle

Footer

EE World Online

EE WORLD ONLINE NETWORK

  • 5G Technology World
  • Analog IC Tips
  • Battery Power Tips
  • Connector Tips
  • DesignFast
  • EDABoard Forums
  • Electro-Tech-Online Forums
  • Engineer's Garage
  • EV Engineering
  • Microcontroller Tips
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips

EE WORLD ONLINE

  • Subscribe to our newsletter
  • Teardown Videos
  • Advertise with us
  • Contact us
  • About Us

Copyright © 2025 · WTWH Media LLC and its licensors. All rights reserved.
The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media.

Privacy Policy