The Second International Symposium on 3D Power Electronics Integration and Manufacturing (www.3D-PEIM.org) will be held June 25-27, 2018, in College Park, Maryland. Engineers and researchers interested in being Lecture and Dialog Session presenters are invited to submit abstracts for review through the Call for Papers section on the symposium’s website (www.3d-peim.org/call-for-papers).

Design and manufacturing professionals from the world’s leading packaging and manufacturing societies and associations will come together at 3D-PEIM to address the future of integrated power electronics design and to advance the 3D power electronics systems of the future. Members of the worldwide electronics community interested in presenting should submit their abstracts by December 15, 2017.

The 3D-PEIM symposium is underwritten by the Power Sources Manufacturers Association (PSMA) as part of its ongoing commitment to educate and inform the power electronics industry. Other supporting organizations include the IEEE Electronics Packaging Society (IEEE/EPS), North Carolina State University, the University of Maryland and Virginia Tech.

“This symposium is all about developing new approaches and technologies for designing and manufacturing power sources,” said General Chair of 3D-PEIM Patrick McCluskey, PhD., Professor of Mechanical Engineering and Leader of the Electronic Products and Systems Division at University of Maryland, College Park. “Tutorials and technical sessions will cover the latest developments in electro-thermo-mechanical co-design, additive manufacturing, embedded circuits, materials, and system integration.”

The following are just a few positive attendee comments about the 2016 symposium:
• “Good balance of academic and industry papers and attendance covering and illustrating research, development, and manufacturing technologies.”
• “It was a very important forum as we move into the post-Moore’s Law/Heterogeneous Integrated era”
• “The keynote speeches were most valuable, providing an excellent recent update on embedded technologies.”

On the day of their presentations, all presenters will have tabletop space in the exhibit area to demonstrate hardware and hold one-on-one discussions. (Symposium exhibitors are also welcome to reserve exhibit-area tabletops to show what is possible in packaging and manufacturing of power electronic systems.)