• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar
  • Skip to footer

Electrical Engineering News and Products

Electronics Engineering Resources, Articles, Forums, Tear Down Videos and Technical Electronics How-To's

  • Products / Components
    • Analog ICs
    • Connectors
    • Microcontrollers
    • Power Electronics
    • Sensors
    • Test and Measurement
    • Wire / Cable
  • Applications
    • Automotive
    • Industrial
    • IoT
    • Medical
    • Telecommunications
    • Wearables
    • Wireless
  • Resources
    • Covid-19
    • DesignFast
    • Ebooks / Tech Tips
    • EE Forums
      • EDABoard.com
      • Electro-Tech-Online.com
    • FAQs
    • 2020 LEAP Awards
    • Oscilloscope Product Finder
    • Podcasts
    • Webinars / Digital Events
    • White Papers
  • Videos
    • Teardown Videos
  • Lee’s Teardowns
    • Teardown Videos
  • Learning Center
  • 5G
  • Women in Engineering

3D flash memory features low read latency, fast I/O

February 22, 2021 By Redding Traiger

Kioxia Corporation and Western Digital Corp. announced that the companies have developed their sixth-generation, 162-layer 3D flash memory technology. Marking the next milestone in the companies’ 20-year joint-venture partnership, this is the companies’ highest density and most advanced 3D flash memory technology to date, utilizing a wide range of technology and manufacturing innovations.

This sixth-generation 3D flash memory features advanced architecture beyond the conventional eight-stagger memory hole array and achieves up to 10 percent greater lateral cell array density compared to the fifth-generation technology. This lateral scaling advancement, in combination with 162 layers of stacked vertical memory, enables a 40 percent reduction in die size compared to the 112-layer stacking technology, optimizing cost.

The Kioxia and Western Digital teams also applied Circuit Under Array CMOS placement and four-plane operation, which together deliver nearly 2.4 times improvement in program performance and 10 percent improvement in reading latency compared to the previous generation. I/O performance also improves by 66 percent, enabling the next-generation interface to support the ever-increasing need for faster transfer rates.

Overall, the new 3D flash memory technology reduces the cost per bit, as well as increases the manufactured bits per wafer by 70 percent, compared with the previous generation. Kioxia and Western Digital continue to drive innovation to ensure continued scaling to meet the needs of customers and their diverse applications.

You may also like:


  • NVMe: The storage underneath 5G and edge computing

  • What is an SoC?

  • Memory centric computing and memory system architectures

Filed Under: Microcontroller Tips Tagged With: kioxiacorporation

Primary Sidebar

EE Training Center Classrooms

“ee

“ee

“ee

“ee

“ee

Featured Resources

  • NEW! EE World Online Learning Center
  • CUI Devices – CUI Insights Blog
  • EE Classroom: Power Delivery
  • EE Classroom: Building Automation
  • EE Classroom: Aerospace & Defense
  • EE Classroom: Grid Infrastructure

February 2021 Special Edition: Power Electronics Handbook

RSS Current EDABoard.com discussions

  • toroidal transformer voltage drop
  • WRS1000
  • What is the DC voltage rating of this Y2 capacitor?
  • Earth interacting with a AC/DC converter
  • Atmega328 Assembly-Send 16 bits serially!

RSS Current Electro-Tech-Online.com Discussions

  • Touch circuit sound, led. 555 timer
  • Please help with failed EMC scan for charity system?
  • Radio Frequency emitter used to propel objects with a parabolic reflector.
  • Low power mic to 2w speaker mono audio circuit design
  • A new motor for my lathe

Oscilloscopes Product Finder

Follow EE World on Twitter

Tweets by @EEWorldOnline

Footer

EE World Online

EE WORLD ONLINE NETWORK

  • DesignFast
  • EDABoard Forums
  • Electro-Tech-Online Forums
  • Microcontroller Tips
  • Analog IC Tips
  • Connector Tips
  • Engineer's Garage
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips
  • Wire & Cable Tips
  • 5G Technology World

EE WORLD ONLINE

  • Subscribe to our newsletter
  • Lee's teardown videos
  • Advertise with us
  • Contact us
  • About Us
Follow us on TwitterAdd us on FacebookFollow us on YouTube Add us on Instagram

Copyright © 2021 · WTWH Media LLC and its licensors. All rights reserved.
The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media.

Privacy Policy