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Main Content

  • Your new engineering assistant runs on algorithms: AI reshapes parts procurement

    Your new engineering assistant runs on algorithms: AI reshapes parts procurement
  • How to compare EMI absorption materials with a cookie tin

    How to compare EMI absorption materials with a cookie tin
  • What are the techniques for managing EMI at the harness-to-PCB interfaces?

    What are the techniques for managing EMI at the harness-to-PCB interfaces?
  • What are the five types of glass used in optical fibers?

    What are the five types of glass used in optical fibers?
  • What are the performance standards for solid state isolators?

    What are the performance standards for solid state isolators?

FROM THE EDITORS


  • Aimee Kalnoskas
    Your new engineering assistant runs on algorithms: AI reshapes parts procurement

  • Martin Rowe
    Rigol oscilloscopes reach 13 GHz bandwidth

  • Emma Lutjen
    Battery architecture uses 100% silicon anode to improve energy density and durability

  • Bill Schweber
    Bus bars are simple in principle, complicated in practice: part 3

  • Jeff Shepard
    What are the five types of glass used in optical fibers?

  • Rick Nelson
    How to choose analog-signal-chain components: part 1

  • Kenneth Wyatt
    How to compare EMI absorption materials with a cookie tin

  • Rakesh Kumar, PhD
    What are the techniques for managing EMI at the harness-to-PCB interfaces?

  • Aharon Etengoff
    What are the best practices for PCB-to-harness transitions?
< >

Martin Rowe’s Videos

Teardown: HP 8112A pulse generator

May 28, 2025 By Martin Rowe

This 50 MHz pulse generator was built as solid as a rock. It’s almost all metal. We take the unit completely apart and look at it from a system and board level. On a visit to the MIT swapfest in 2024, I came across an HP 8112A 50 MHz pulse … [Read More...] about Teardown: HP 8112A pulse generator

More Posts from this Category

Today on EE World

  • Your new engineering assistant runs on algorithms: AI reshapes parts procurement
  • How to compare EMI absorption materials with a cookie tin
  • What are the techniques for managing EMI at the harness-to-PCB interfaces?
  • TVS diodes use foldback technology to cut clamping voltage
  • Wireless module adds MCU, Zigbee, and Bluetooth connectivity to IoT designs
  • Detection system finds manufacturing faults from photos and videos
  • What are the five types of glass used in optical fibers?

FAQs

How to compare EMI absorption materials with a cookie tin

Product enclosures have frequency resonances that can produce unwanted EMI. Absorption of materials in the cavity can reduce EMI. Use a cookie tin to compare materials before inserting them … Read about How to compare EMI absorption materials with a cookie tin

What are the techniques for managing EMI at the harness-to-PCB interfaces?

Electromagnetic interference (EMI) at harness-to-PCB connections creates one of the biggest challenges in modern electronics design. These interface points act as weak spots where unwanted … Read about What are the techniques for managing EMI at the harness-to-PCB interfaces?

What are the five types of glass used in optical fibers?

Most optical fibers use silica (SiO2) glass as their core material, but other types of glass are used in specialized applications. The five types of glass used in optical fibers are silica … Read about What are the five types of glass used in optical fibers?

What are the performance standards for solid state isolators?

Solid state isolators (SSIs) use coreless transformers (CTs) to provide electrical isolation between circuits while supporting power and signal connections. Isolation supports safety, noise … Read about What are the performance standards for solid state isolators?

More FAQs

Focus on Analog ICs

What are the best practices for PCB-to-harness transitions?

Transition points between PCB traces and wire harnesses impact signal integrity, system-level reliability, and manufacturability. Improperly calibrated transition points can introduce impedance … [Read More...] about What are the best practices for PCB-to-harness transitions?

Streamlining PCB-to-wire harness design integration with EDA tools

Automotive wiring harnesses consolidate multiple wires and cables into a single organized system, transmitting power and signals between electronic control units (ECUs). These harnesses connect … [Read More...] about Streamlining PCB-to-wire harness design integration with EDA tools

More Analog IC News

Focus on Microcontrollers

How does the Zenoh protocol enhance edge device operation?

Zenoh is an open-source platform that manages data in transit and at rest across the entire edge-to-cloud continuum, as well as facilitates computations on edge devices. Targeted applications include … [Read More...] about How does the Zenoh protocol enhance edge device operation?

RAID storage system supports PCIe Gen 5 and Gen 4 connectivity

HighPoint Technologies introduces its next-generation NVMe RAID storage solutions, engineered to meet the demanding data ingestion and processing requirements of AI, autonomous systems, and … [Read More...] about RAID storage system supports PCIe Gen 5 and Gen 4 connectivity

More Microcontroller News

Focus on Power Electronics

TVS diodes use foldback technology to cut clamping voltage

Littelfuse, Inc. announced the launch of the 5.0SMDJ-FB TVS Diode Series, a 5000 W surface-mount solution in a DO-214AB package engineered to protect sensitive DC power lines from overvoltage transients. The new series incorporates foldback … [Read More...] about TVS diodes use foldback technology to cut clamping voltage

What are the performance standards for solid state isolators?

Solid state isolators (SSIs) use coreless transformers (CTs) to provide electrical isolation between circuits while supporting power and signal connections. Isolation supports safety, noise immunity, reliability, and other performance … [Read More...] about What are the performance standards for solid state isolators?

More Power Electronics News

Optimizing HVAC Performance at the Sub-System Level

Designing for Serviceability: The Role of Interconnects in HVAC Maintenance

How smart connector selection simplifies installation, diagnostics, and long-term reliability When HVAC systems require servicing, connector design can make the difference between a fast resolution and extended downtime. OEMs are now prioritizing … [Read More...] about Designing for Serviceability: The Role of Interconnects in HVAC Maintenance

From Control Boards to Comfort: How Signal Integrity Drives HVAC Innovation

Inside the sub-systems enabling smarter, more connected HVAC experiences By TE Connectivity - Appliance & HVAC Solutions Today’s connected HVAC systems rely on precise data exchange to drive performance, efficiency, and user comfort. From smart … [Read More...] about From Control Boards to Comfort: How Signal Integrity Drives HVAC Innovation

Built to Withstand: Sealing and Thermal Protection in HVAC Sub-Systems

How ingress protection and thermal resilience help HVAC systems perform in extreme conditions By TE Connectivity - Appliance & HVAC Solutions In today’s HVAC systems, performance can be compromised by more than just poor design. Environmental … [Read More...] about Built to Withstand: Sealing and Thermal Protection in HVAC Sub-Systems

Smarter HVAC Starts at the Sub-System Level

Improve performance, reliability, and integration by engineering each HVAC sub-system with purpose-built connectivity solutions. By TE Connectivity - Appliance & HVAC Solutions Today’s HVAC systems are expected to deliver greater energy … [Read More...] about Smarter HVAC Starts at the Sub-System Level

More Posts

Focus on 5G

Wireless module adds MCU, Zigbee, and Bluetooth connectivity to IoT designs

Quectel Wireless Solutions has announced the launch of its latest high-performance MCU Zigbee and BLE module, the KCMA32S. This innovative module is designed to meet the growing demands of IoT applications, featuring advanced connectivity options and … [Read More...] about Wireless module adds MCU, Zigbee, and Bluetooth connectivity to IoT designs

What are the five types of glass used in optical fibers?

Most optical fibers use silica (SiO2) glass as their core material, but other types of glass are used in specialized applications. The five types of glass used in optical fibers are silica glass, germanosilicate glass, borosilicate glass, … [Read More...] about What are the five types of glass used in optical fibers?

More 5G news

Focus on Test & Measurement

How to compare EMI absorption materials with a cookie tin

Product enclosures have frequency resonances that can produce unwanted EMI. Absorption materials in the cavity can reduce EMI. Use a cookie tin to compare materials before inserting them into your product. As operating frequencies approach microwaves, enclosures can appear as resonant cavities and amplify EMI emissions. When I was working on space shuttle communications systems, […]

Detection system finds manufacturing faults from photos and videos

TDK Corporation unveiled the latest TDK SensEI product line, edgeRX Vision. edgeRX Vision is a high-speed defect detection system that analyzes customer product images or movies and is capable of identifying even the smallest components—down to 1 mm by 0.5 mm—with exceptional precision. Powered by advanced AI, the system delivers real-time, highly accurate defect detection […]

More Posts from this Category

Embedded Systems

Embedded compute modules enable Windows with ARM architecture transition for industrial automation

Tria has introduced a family of embedded compute modules featuring Qualcomm Dragonwing processors with multi-operating system support. The modules support Android, Windows 11 IoT Enterprise, and Yocto Linux, enabling deployment across industrial, … [Read More...] about Embedded compute modules enable Windows with ARM architecture transition for industrial automation

AI-accelerated MCU combines voice and vision processing capabilities

Renesas Electronics announced the RA8P1, an AI-accelerated microcontroller designed for AIoT (Artificial Intelligence of Things) applications. The device combines ARM Cortex-M85 and Cortex-M33 cores with an Ethos-U55 Neural Processing Unit (NPU), … [Read More...] about AI-accelerated MCU combines voice and vision processing capabilities

More Embedded Systems News

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