Aries Electronics, an international manufacturer of
standard, programmed, and custom interconnection products, has expanded its
line of Fine Pitch Bump Adapters to include adapters that accommodate boards
with pitches down to 0.4 mm. As part of the Correct-A-Chip series, the Fine
Pitch Bump Adapters allow customers to use higher pitch devices on smaller
pitch boards.
The adapter tops have landing pads that can be designed to
accept any device on any pitch and easily settle into fine pitch footprints,
including Thin-Shrink Small Outline Packages (TSSOP) and Quad Flat Packages
(QFP) with pitches down to 0.4 mm. In addition, the adapter bottom has raised
connection pads up to 0.01 in. (0.25 mm) that provide easy mounting of the
adapter to the target board.
Due to the open space now available on the top of the
adapter board, manufacturers can easily add components to the design at a
minimal cost. Fine Pitch Bump Adapters save users money by integrating higher
pitch BGA devices with boards laid out with smaller pitches that typically
could not be used together.