• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar
  • Skip to footer

Electrical Engineering News and Products

Electronics Engineering Resources, Articles, Forums, Tear Down Videos and Technical Electronics How-To's

  • Products / Components
    • Analog ICs
    • Battery Power
    • Connectors
    • Microcontrollers
    • Power Electronics
    • Sensors
    • Test and Measurement
    • Wire / Cable
  • Applications
    • 5G
    • Automotive/Transportation
    • EV Engineering
    • Industrial
    • IoT
    • Medical
    • Telecommunications
    • Wearables
    • Wireless
  • Learn
    • eBooks / Handbooks
    • EE Training Days
    • Tutorials
    • Learning Center
    • Tech Toolboxes
    • Webinars & Digital Events
  • Resources
    • White Papers
    • Design Guide Library
    • Digital Issues
    • Engineering Diversity & Inclusion
    • LEAP Awards
    • Podcasts
    • DesignFast
  • Videos
    • EE Videos and Interviews
    • Teardown Videos
  • EE Forums
    • EDABoard.com
    • Electro-Tech-Online.com
  • Bill’s Blogs
  • Advertise
  • Subscribe

VPX SBCs upgrade USAF Sigint, Elint systems

May 19, 2021 By Lee Teschler Leave a Comment

The VP460 6U VPX Direct RF Processing System and the SBC627 6U OpenVPX rugged single board computer from AMETEK Abaco Systems are part of an electronics intelligence (ELINT) and signal intelligence (SIGINT) capabilities upgrade for radio frequency data intelligence gathering over a distributed fleet of U.S. Air Force aircraft.

The VP460 is an industry-leading Direct RF Processing System that combines an integrated Xilinx Zynq Radio Frequency ametekSystem-on-Chip (RFSoC) and a powerful Xilinx Virtex FPGA for ultra-fast onboarding and processing of RF signals. The SBC627 features the 5th Generation Intel Core i7 processor. Used in conjunction, the VP460 processes data, while the SBC627 acts to interface with the data received and transmit that data to the end user for further processing. The combination of the processor and SBC delivers a cohesive system which provides for front-end RFSoC and backend post processing, data collection and algorithm management through the second FPGA on the card.

This innovative solution is the first that delivers the combination of an RFSoC with powerful FPGA in a single card design with high-speed back plane interconnect while being ruggedized to meet the environmental performance requirements.

Pete Thompson, VP of Product Management at Abaco said, “Our innovative approach with the VP460 and SBC627 brings the opportunity to supply an upgrade from old systems, which recorded data for later analysis, to new technology allowing for real-time processing of ELINT and SIGINT with the latest tech offerings. Delivering best in class products to assist in mission-critical operations is at the core of our commitment to supporting warfighters on land, air and sea.”

The VP460 is a 6U VPX RF processing system featuring the transformational Xilinx Zynq Ultrascale+ RF system-on-chip (RFSoC) technology coupled with the latest Xilinx Virtex Ultrascale+ High Bandwidth Memory (HBM) FPGA device. The HBM VU37P device features the speed and capabilities of an UltraScale+ FPGA together with integrated DRAM in the FPGA package, capable of up to 460 GB/sec data transfer rates on-chip. The RFSoC device includes 16 integrated ADCs at 2GSPS, 16 DACs at 6.4 GSPS, a user-programmable FPGA fabric, and multi-core Zynq ARM processing subsystem.

The SBC627 6U OpenVPX SBC is designed to meet the requirements of a wide range of applications from commercial and industrial through to fully rugged defense and aerospace programs. It features the high performance, highly integrated 5th Generation Intel Core i7 processor platform, which offers integrated graphics and ECC memory controllers plus quad-core processing up to 2.7 GHz all in one device. Coupled with the Mobile Intel QM87 Express Chipset this provides an unmatched level of I/O bandwidth for both on-board and offboard functions. In addition to a comprehensive range of onboard I/O features, the SBC627 also offers on-board XMC mezzanine expansion sites for enhanced system flexibility. It offers extended temperature capability and a range of air- and conduction-cooled build levels.

You Might Also Like

Filed Under: Aerospace & Defense, Applications Tagged With: abacosystems, ametek

Reader Interactions

Leave a Reply Cancel reply

You must be logged in to post a comment.

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Primary Sidebar

EE Engineering Training Days

engineering

Featured Contributions

Five challenges for developing next-generation ADAS and autonomous vehicles

Robust design for Variable Frequency Drives and starters

Meeting demand for hidden wearables via Schottky rectifiers

GaN reliability milestones break through the silicon ceiling

From extreme to mainstream: how industrial connectors are evolving to meet today’s harsh demands

More Featured Contributions

EE Tech Toolbox

“ee
Tech Toolbox: 5G Technology
This Tech Toolbox covers the basics of 5G technology plus a story about how engineers designed and built a prototype DSL router mostly from old cellphone parts. Download this first 5G/wired/wireless communications Tech Toolbox to learn more!

EE Learning Center

EE Learning Center
“ee
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.
“bills
contribute

R&D World Podcasts

R&D 100 Episode 10
See More >

Sponsored Content

Advanced Embedded Systems Debug with Jitter and Real-Time Eye Analysis

Connectors Enabling the Evolution of AR/VR/MR Devices

Award-Winning Thermal Management for 5G Designs

Making Rugged and Reliable Connections

Omron’s systematic approach to a better PCB connector

Looking for an Excellent Resource on RF & Microwave Power Measurements? Read This eBook

More Sponsored Content >>

RSS Current EDABoard.com discussions

  • Discrete IrDA receiver circuit
  • No Output Voltage from Voltage Doubler Circuit in Ansys Nexxim (Harmonic Balance Simulation)
  • ISL8117 buck converter blowing up
  • I²C Ground Isolation with Series Battery Cells (ULIN13-01 + PIC18LF4520)
  • Mean offset increase in post-layout simulation of clocked comparator

RSS Current Electro-Tech-Online.com Discussions

  • Kawai KDP 80 Electronic Piano Dead
  • using a RTC in SF basic
  • Saga 1400sv vinyl cutter motherboard issue
  • Unknown smd. Any ideas?
  • Display TFT ST7789 (OshonSoft Basic).
Search Millions of Parts from Thousands of Suppliers.

Search Now!
design fast globle

Footer

EE World Online

EE WORLD ONLINE NETWORK

  • 5G Technology World
  • Analog IC Tips
  • Battery Power Tips
  • Connector Tips
  • DesignFast
  • EDABoard Forums
  • Electro-Tech-Online Forums
  • Engineer's Garage
  • EV Engineering
  • Microcontroller Tips
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips

EE WORLD ONLINE

  • Subscribe to our newsletter
  • Teardown Videos
  • Advertise with us
  • Contact us
  • About Us

Copyright © 2025 · WTWH Media LLC and its licensors. All rights reserved.
The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media.

Privacy Policy