Because of its high technical thresholds, integrated 3D IC solutions will not be commercialized on a large scale until 3-5 years, according to Tong Ho-ming, general manager and chief of R&D for Advanced Semiconductor Engineering (ASE).
However, development of so-called “2.5D” integrated ICs in Taiwan, from foundries to backend companies, is ready to move to the next stage, Tong indicated. Which will pave the road for 2D IC to migrate to 3D IC using existing infrastructure.
Tong expects commercialization of 2.5D chip technology to take place in two years.
In addition, Tong noted that 2.5D IC should not be regarded as a transitional integration technology. Based on silicon interposer, 2.5D integration enables a smooth process transition to 28nm from 40nm. The technology can also be applied in the design of high-end multi-function-integrated ICs, and thus is expected to be developed in parallel with 3D IC as an alternative solution, Tong said.
Tong believes that commercialized products made using 2.5D IC and 3D IC technologies, including smartphones and computing applications, will hit the market in the next five years.