SMP has developed “All Mode” EMC filters with high-frequency stability. The High-Frequency Composite Materials (HFCM) developed and manufactured by SMP are effective for frequencies up to the gigaHertz range and satisfy all of the requirements to which modern SiC and GaN applications are subject. The All Mode design damps both differential mode and common mode […]
Film capacitors for dc link applications
TDK Corp. has extended the portfolio of EPCOS film capacitors for DC link applications with the B3277*X/Y/Z series. The new capacitors feature compact dimensions, high capacitance density, and high current capability. They are designed for rated voltages of between 500 and 1200 V DC. The series offers numerous standard capacitance values within the range from […]
Programmable baseband processors target 5G, mmWave tasks
NXP Semiconductors N.V. announced a new series of Layerscape Access processors, designed for 5G Access Edge applications. These new Layerscape Access processors target a variety of deployment scenarios compliant with O-RAN Alliance specifications, including Central Units/Distributed Units (CU/DU), Radio Units (RUs), along with Integrated Small Cells and Customer Premises Equipment (CPE) systems. NXP Layerscape Access processors […]
Tiny, dual-channel PPTC protects network and telecom equipment
Littelfuse, Inc. announced a new series of 250V Telecom PPTCs designed to help make telecom and network equipment more reliable. The TSM250-130 series protects against power cross and induced power surges as defined in ITU, Telcordia GR1089 and IEC 62368-1. Because it combines two resistance-matched PPTCs in a single surface-mount housing, it reduces the board […]
Senior managers purchase CUI Inc’s electronic components business and form CUI Devices
Former senior managers of CUI Inc announced that they have purchased the company’s industry-leading components business from CUI Inc’s publicly-traded parent company, CUI Global. The newly-formed private entity will go to market as CUI Devices and will continue to serve its customers and develop new technologies within its interconnect, audio, thermal management, motion and sensors product […]
3×3 Wi-Fi 6 chip supports 2.4-GHz, 5-GHz and future 6-GHz bands
Broadcom Inc. announced the availability of its 3×3 Wi-Fi 6 chip, the BCM6710, designed for WLAN applications including Wi-Fi routers, residential gateways, wireless range extenders, and set-top boxes. The BCM6710 is a highly optimized Wi-Fi 6 chip with integrated RF power amplifiers, providing OEMs a cost-effective, high-performance solution for their mass-market products. The BCM6710 is […]
Computing module includes cinema-grade video capture, AI platform
Intrinsyc Technologies Corporation announced the Open-Q 845 µSOM (micro System on Module) and Development Kit, to be available in the fourth quarter of 2019. The Open-Q 845 µSOM is the latest product in the evolution of Intrinsyc’s µSOM computing module series. It is an ultra-compact (50mm x 25mm), production-ready embedded module, ideal for powering the most advanced […]
Vibration resistant quartz crystals handle harsh environments
Fox Electronics has introduced its vibration-resistant crystal – C3VR. The low G sensitivity crystal can improve dynamic performance of customer systems under harsh conditions. The C3VR has a maximum 0.2ppb/G acceleration sensitivity rating. It is not unusual to see an oscillator at rest, (no external vibration), outperform one under vibration by 30dB at 1G. The […]
Motor driver boards speed mikroBUS-format design work
STMicroelectronics has collaborated with MikroElektronika, an Authorized ST Partner, to create four Click boards that extend the advantages of STSPIN motor drivers beyond STM32-based designs to users of MikroElektronika prototyping boards, as well as other systems containing a mikroBUS socket. ST’s STSPIN ICs simplify motor control by integrating the advanced control features, protected output stage, and […]
4-pin SiC MOSFETs deliver 35% lower switching loss over conventional packages
Rohm announced the availability of six new trench gate structure SiC MOSFETs (650V/1200V), the SCT3xxx xR series, ideal for server power supplies, UPS systems, solar power inverters, and EV charging stations requiring high efficiency. The SCT3xxx xR series utilizes a 4-pin package (TO-247-4L) that maximizes switching performance, making it possible to reduce switching loss by up […]
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