Celeno Communications, a leading provider of smart, innovative Wi-Fi solutions, is launching the world’s first single chip solution for client devices combining Wi-Fi 6/6E, BT/BLE (Bluetooth/ Bluetooth Low Energy) 5.2 and Celeno’s novel Wi-Fi Doppler Radar. Celeno’s new CL6000 “Denali” product family provides a connectivity and sensing solution for devices such as consumer multimedia devices, IoT […]
High-temperature power DC-Link film capacitor targets auto, energy apps
KEMET, part of the YAGEO Group and leading global electronic components supplier, announces its new C4AK high temperature, power film DC-Link capacitor designed for continuous operation up to 1,000 hours at 135℃. The C4AK series joins the C4AU (harsh environment) and C4AQ-P (125°C) family of power DC-Link film capacitors. These series offer higher capacitance density, […]
Fuses for space apps boast static-dissipative polyester packaging
SCHURTER has improved the packaging of its space fuse series MGA-S, with an enhanced dissipative structure on the outer layer of the ESD bag. The outer layer of the old packaging was aluminum with abrasion-resistant coating. The material of the outer layer of the new packaging is a static-dissipative polyester. The MGA-S is hermetically sealed […]
Mobile PCI Express modules target resource-constrained edge computing/embedded AI apps
ADLINK Technology Inc., today introduced the industry’s first embedded MXM-based graphics modules based on NVIDIA’s Turing architecture, to accelerate edge AI inference in SWaP-constrained applications. GPUs are increasingly used to provide AI inferencing at the edge, where size, weight and power (SWaP) are key considerations. The embedded MXM graphics modules offer high-compute power required to […]
Transceiver eval kit handles optical gigabit connectivity in vehicles
KDPOF presents the new extensive evaluation kit EVK9351AUT for a quick and easy project launch of optical gigabit connectivity in vehicles. “Our new EVK9351AUT equips carmakers, suppliers, and test houses to fully evaluate the KDPOF automotive transceivers KD9351 and KD1053 for automotive optical 1000BASE-RHC PHY implementation,” explained Carlos Pardo, CEO and Co-founder of KDPOF. “We […]
Interactive sizing selection guide covers surge protective sevices
Littelfuse, Inc., announced today the launch of a surge protective device (SPD) selection guide that sizes SPDs to achieve the best level of protection for a system based on specifications provided. Surge protective devices need to be sized correctly. If they are sized too low, the system could be susceptible to temporary overvoltages as well […]
Toolbox enables Simulink, MATLAB model execution on embedded processors
Green Hills Software, announced today the immediate availability of the MULTI Toolbox for Embedded Coder, enabling engineers to easily and efficiently develop and deploy their Simulink and MATLAB models on a wide range of embedded processors. The integration bridges advanced software development products from industry leaders in their respective domains – MathWorks, the leading developer […]
Development tools for Traveo II MCUs optimized for auto-body electronics apps
IAR Systems, presents a complete set of development tools for the TraveoTM II family of microcontrollers (MCUs) from Infineon, bringing a powerful solution with AUTOSAR support to companies working with automotive body electronics applications. In addition, IAR Systems provides an online IAR Academy On Demand training course specifically aimed for developers who are new to […]
Supercapacitor line now ranges from coin cell, radial form factors, large snap-in types
New Yorker Electronics has announced its distribution of the newly expanded Cornell Dubilier line of Supercapacitors. Additional capacitance values and cell sizes have been added to its already extensive supercapacitor platforms, the DGH 2.7 volt and DSF 3.0-volt series. The company’s product line now ranges from board-mountable coin cell types to radial form factors […]
Rad-hardened Arm MCU includes added embedded analog capabilities
Deep space initiatives including planetary exploration, orbiter missions and space research require innovative spacecraft system technology providing connectivity and processing. To enable system designers better integration and higher performance while reducing development costs and time to market, COTS technologies and scalable solutions are increasingly used in space applications. Microchip Technology Inc. today announced the qualification […]
