The Procyon advanced benchtop/rack mount battery test system for engineering design and production testing of high-performance electro-mobility battery packs utilizes Intepro’s innovative bi-directional charge/discharge regenerative power stage that returns over 93% of the power back to the ac mains, lowering operating costs, reducing system size and eliminating/reducing external cooling requirements. The system utilizes Intepro’s “fill-in-the […]
DSC/FEC video generator and FEC link layer compliance tests now available
The new 980 DisplayPort 1.4 Video Generator/Analyzer module now supports the industry’s first DSC/FEC video generator and additional link-layer compliance tests for FEC, main link audio, video and power management. Initiated through the intuitive 980 Manager GUI, these tests are becoming a requirement for products to carry the VESA logo, signifying that the DisplayPort has […]
Modular dc supplies target smart home and IoT apps
The RAC15-K and RAC20-K series are designed for low-power IoT and household applications. These ac/dc modules have ultra-low energy losses especially in light load conditions and minimal standby power consumption. Based on the footprint of the compact RAC10-K modules, these new modules feature high-efficiency over a wide load range. This makes them candidates for the […]
30 GHz BGA socket for BGA169 packages
A new high-performance BGA socket for 0.5-mm-pitch BGA 169 pin devices called the CG-BGA-5027 socket is designed for a 7×7-mm package size and operates at a bandwidth up to 30 GHz with less than 1 dB of insertion loss. The socket is designed with an easy open clamshell lid with integrated compression mechanism. The contact […]
Image gallery: Technology on display at ADAS & Autonomous Vehicles USA 2018
TU_Automotive put on its ADAS technology event in Detroit Oct. 16 and 17, featuring presentations from firms such as Toyota, Volvo, Ford, Lear Corp., Harman, Mitsubishi Electric, GM Ventures, Navigant Research, and start-up companies CalmCar, Seeva Technologies and AlphaCs Corp. Here are a few of the more intriguing displays we perused during the event. NEXT […]
Extended break-fix support for programmable power supplies
The first phase of the AMECare Reliability Assurance service level agreement (SLA) program is designed to provide “white glove” support for customers’ covered mission-critical power and test devices, with regular preventative maintenance break-fix support and legacy upgrades, beginning with a product’s purchase and extending through its entire lifecycle. The goal of the Reliability Assurance program […]
Stamped spring pin socket for 0.8-mm pitch Infineon LFBGA
A new socket addressing high-performance requirements for Burn-in and Test applications is called the SBT-BGA-6553. The contactor is a stamped-spring pin with 31-gm actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss is < 1 dB at 15.7 GHz, and capacitance 0.097 pF. […]
Super-tiny sensor platforms, facile headlights, and “trainspotting” microphones mark STMicroelectronics’ Technology Tour
Technology demonstrations and tutorials marked the one-day Technology Tour event put on by STMicroelectronics in the Detroit area. Here are a few of the exhibits and tech presentations that caught our eye. NEXT: Headlights that swivel
Protocol analyzer and exerciser platforms address need for UFS storage media testing
The Eclipse T42 UniPro/UFS protocol analyzer and Eclipse M42x UniPro/UFS protocol analyzer/exerciser platforms offer design and test engineers and system integrators a robust and cost-effective approach to test UFS, the current storage media standard in smartphones, tablets and embedded systems such as heads-up displays (HUD) and advanced driver-assistance systems (ADAS). The Eclipse Protocol Analyzer and […]
Low-profile DOSA converters hit 99% efficiency
New power modules offer one of the highest power densities in a DOSA footprint on the market with a profile of only 3.75 mm. They provide either 1, 2, 3, or even 6 A in the same-sized package for scalability. The 6-A module has at least 50% higher power density than its peers on the […]