The measurement capability of the Anritsu MT8821C Radio Communications Analyzer has been augmented with the release of LTE-Advanced software solutions. When the new LTE-Advanced FDD DL CA 6CCs Measurement Software MX882112C-061 and LTE-Advanced TDD DL CA 6 CCs Measurement Software MX882113C-061 for LTE-Advanced/LTE Advanced Pro DL 6CA are installed, the MT8821C supports RF and PHY […]
Multiprotocol wireless software handles IoT connectivity for next-gen apps
New dynamic multiprotocol software for the Wireless Gecko system-on-chip (SoC) and module portfolio enables simultaneous operation of Zigbee and Bluetooth low energy (LE) on a single SoC. This package handles Internet of Things (IoT) applications without incurring the additional complexity and hardware cost of a two-chip architecture, thereby reducing the wireless subsystem bill-of-materials (BOM) cost […]
Rugged interconnects target wind energy apps
An array of high quality, reliable connectors are designed for use in the wind power industry. Amphenol LTW (ALTW), a division of Amphenol Industrial Products Group, offers a line of waterproof screw vents for industrial applications. The Screw Vent M12 series provides a durable and reliable solution for complete enclosures in harsh environments. Designed to […]
Rugged interconnects target wind energy apps
An array of high quality, reliable connectors are designed for use in the wind power industry. Amphenol LTW (ALTW), a division of Amphenol Industrial Products Group, offers a line of waterproof screw vents for industrial applications. The Screw Vent M12 series provides a durable and reliable solution for complete enclosures in harsh environments. Designed to […]
BGA elastomer sockets operate up to 40 GHz with less than 1 dB insertion loss
A new high-performance elastomer socket for 0.4-mm pitch BGA packages is called the SG25-BGA-2042. Developed by Ironwood Electronics, the socket is designed for a 4.47×4.34-mm package size and operates at bandwidths up to 40 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ/pin. Network analyzer reflection […]
CFD program features better handling of LED properties
Enhancements to a computational fluid dynamics (CFD) package called FloEFD include an improved module for handling LEDs wherein the user can define light intensity and radiation spectrum as a function of angle. As a result, the FloEFD software can automatically apply the calculated radiant flux on top of the LED. Users of the package, from […]
Open-frame supplies hit 30 W/in3 densities
The VOF‑180 and VOF‑225A series, outputting 180 W and 225 W of continuous power respectively, feature high efficiencies up to 94% and high power densities up to 30 W/in3. Housed in compact, low profile packages measuring as small as 2x4x0.75 in. (50x101x19 mm), these ac-dc power supplies provide space and energy saving benefits for IT […]
Deep-depletion technique could bring better power MOSFETs
Researcher say the deep-depletion regime of bulk-boron-doped wide band gap semiconductors could be an avenue toward power MOSFETs able to handle large voltages and high temperatures. A group with members based in France, the UK and Japan applied the technique to diamond-based MOSFETs. But they say a similar scheme would work in other wide-band-gap semiconductors. […]
Rack-mount hot-swap supplies available with LAN interface modules
LAN (Local Area Network) modules work with HFE series 1.6 kW and 2.5 kW rack mounted, hot swap power supplies. These optional modules allow remote monitoring, status check and programming through a number of standard protocols, supporting VISA (Virtual Instrument Software Architecture). The LAN option is suitable for computer networking, telecommunications, test and measurement and […]
2018 International Symposium on 3D Power Electronics issues call for papers
The Second International Symposium on 3D Power Electronics Integration and Manufacturing (www.3D-PEIM.org) will be held June 25-27, 2018, in College Park, Maryland. Engineers and researchers interested in being Lecture and Dialog Session presenters are invited to submit abstracts for review through the Call for Papers section on the symposium’s website (www.3d-peim.org/call-for-papers). Design and manufacturing professionals […]