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Mary Gannon

Low-profile backflip FPC connector launched by Hirose

June 30, 2017 By Mary Gannon Leave a Comment

Hirose has developed a compact flexible printed circuit (FPC) connector that offers a super low-profile of only 0.5 mm with a space-saving 0.25-mm pitch and depth of only 3.15 mm when locked. The FH64MA Series contributes to profile reduction in a variety of portable and consumer devices including active trackers, electronic labelers, laptops/tablets, portable audio […]

Filed Under: Applications, Connector Tips, Consumer, Wearables Tagged With: hirose

Fairview Microwave releases BMA connectors and adapters with VSWR as low as 1.15:1

June 20, 2017 By Mary Gannon Leave a Comment

Fairview Microwave Inc. has launched a new product line made-up of 45 BMA connectors with VSWR as low as 1.2:1, and seven BMA adapters with VSWR as low as 1.15:1. Typical applications include blind mating, RF backplanes, rack and panel connectivity, high-speed switching and use in phased array systems. Fairview’s new line of 54 BMA […]

Filed Under: Uncategorized Tagged With: fairviewmicrowave

ITT to highlight interconnects for aviation at Paris Air Show

June 20, 2017 By Mary Gannon Leave a Comment

ITT Inc. is displaying its comprehensive cabin and aircraft interior solutions portfolio at the 2017 International Paris Air Show, this week. The company will highlight its broad range of solutions at Stand A98 in Hall 3 at the Paris Le Bourget Exhibition Centre. ITTs highly engineered solutions enhance every aspect of the passenger flying experience. […]

Filed Under: Uncategorized

Fischer Connectors launches faster, stronger, lighter interconnect innovations at Paris Air Show

June 20, 2017 By Mary Gannon Leave a Comment

Fischer Connectors will showcase its innovative products designed to meet customers´ growing needs for faster, more powerful and smaller solutions in aerospace applications at the International Paris Air Show (June 19-25).  Visitors can discover the new Fischer MiniMaxTM Series USB 3.0 and the new Fischer UltiMateTM Series Power and get a preview of the LP360 […]

Filed Under: Uncategorized

Mill-Max launches swage mount PCB pins for interconnect applications

June 15, 2017 By Mary Gannon Leave a Comment

Mill-Max is adding to its diverse mix of swage mount PCB pins with six new offerings designed for interconnect applications. These swage mount terminals are designed to be mechanically fastened to a board or panel and plugged into sockets or soldered into mating boards in board stacking and other interconnect configurations. Swage pins are often […]

Filed Under: Uncategorized

TE Connectivity highlights how its tech enables next-generation connected aircraft

June 12, 2017 By Mary Gannon Leave a Comment

TE Connectivity (TE) will exhibit at the Paris Air Show, Hall 2B, #32, June 19-25. With commercial aircraft facing the challenge to deliver more data at higher speeds, engineers must find ways to make flight travel more efficient and safe while managing increasingly complex aircraft systems. TE has developed technologies that help improve performance in […]

Filed Under: Uncategorized

SMA coaxial test probe assemblies from Amphenol RF offer M2M testing solutions

June 7, 2017 By Mary Gannon Leave a Comment

Amphenol RF is pleased to offer SMA test probe assemblies as part of its comprehensive line of pre-configured coaxial cable assemblies. This new configuration features high-performance 0.047 and 0.085-in. diameter hand formable semi-rigid cables. The cable assemblies feature a gold-plated, precision-machined brass body, a gold-plated beryllium copper contact, and PTFE insulator. Amphenol RF’s SMA test […]

Filed Under: Uncategorized

W.L. Gore introduces new Phaseflex microwave/RF test assemblies

June 7, 2017 By Mary Gannon Leave a Comment

W. L. Gore & Associates (Gore) has introduced the new Gore PhaseFlex microwave/RF test assemblies, type 0N for high density test/interconnection—a lightweight assembly that ensures consistent, repeatable measurements with stable electrical performance up to 50 GHz. High-density and modular test instruments for wireless devices and aerospace systems have become increasingly complex, with a larger number of […]

Filed Under: Uncategorized

What are nanominiature or Nano-D connectors?

June 6, 2017 By Mary Gannon Leave a Comment

Nanominiature or nano-D connectors are offered as both rectangular and circular high-density assemblies. These tiny interconnects use twist pin contact technology to provide a reliable connection even in harsh conditions that encounter shock and vibration, all with low separation force and engagement.   Most nano-D connectors are based on MIL-DTL-32139 specification for use in aerospace […]

Filed Under: Uncategorized

50-Ohm HD-BNC cable assemblies from Amphenol RF offer high-density solutions

May 30, 2017 By Mary Gannon Leave a Comment

Amphenol RF introduces fixed length 50 Ohm HD-BNC cable assemblies as an ideal pre-configured solution for high-performance applications. These lightweight, compact cable assemblies deliver a space conscious option for designers and engineers, at a footprint of 51% smaller than traditional BNC connectors, and allows for four times the density. Amphenol RF’s 50 Ohm HD-BNC cable […]

Filed Under: Uncategorized Tagged With: amphenolrf

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