Ironwood Electronics recently introduced a new Stamped spring pin socket addressing high performance requirements for testing BGA208 – CBT-BGA-7041. The contactor is a stamped spring pin with 31-g actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss < 1 dB at 15.7 GHz […]
HARTING and HIROSE focus on a new standard
HARTING Electronics GmbH, based in Espelkamp, and HIROSE Electric C. Ltd., Tokyo, have reached agreement on the joint development, product standardization and marketing of a miniaturized connection technology…
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High-density multi-conductor terminal blocks
Phoenix Contact introduces PT 2,5/S-QUATTRO terminal blocks. These four-position terminal blocks occupy the same amount of space as the company’s two-position terminal blocks. This allows for a high…
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Siemon Interconnect Solutions Joins Open Compute Project as a Community Member
Siemon Interconnect Solutions announces the participation as a Community Member in the Open Compute Project (OCP). The Open Compute Project (OCP) is a collaborative community focused on redesigning…
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Brad M12 Power F-Coded Connectors Deliver 16.0A Current Carrying Capacity
Molex, LLC has introduced Brad M12 Power F-Coded cordsets and receptacles, featuring an industry-leading current carrying capacity of up to 16.0A per pin with a blind-mate key design….
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Space-saving back flip FPC connector
Hirose has launched a compact flexible printed circuit (FPC) connector that supports USB 3.0, Embedded DisplayPort ver1.3 and MIPI D-PHY ver1.1 standards. The FH58 family of FPC connectors…
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AVX announces the 6411 Series PCI Express M.2 connectors
AVX Corporation, announces the 6411 Series PCI Express M.2 connectors from Kyocera Connector Products. Compatible with the new M.2 specification developed by the Peripheral Component Interconnect Special Interest…
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Amphenol RF expands MCX product line
Amphenol RF has introduced an expansion to its line of MCX interconnects. Recognized for their small package size and dependable performance, MCX connectors are a popular choice among…
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TE Connectivity introduces Half-Size VITA 66.4 module
TE Connectivity (TE) announces a new Ruggedized Optical Backplane interconnect systems that provide a high-density, blind-mate optical interconnect in a backplane/daughtercard configuration. The half-sized connectors are fully compliant to the…
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Molex debuts 2X2 PoE 2.5 GbE multi-port magnetic modular jacks
Molex has introduced a 2X2 PoE 2.5 Gigabit Ethernet (GbE) Multi-Port Magnetic Modular Jack, or Integrated Connector Module (ICM), joining the previously released 2X4 configuration. Currently, no other…
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