At Sensors Expo 2019, Neil Cersell, President of the Cersell Company Inc., explains his company’s magnetic sensors that are available beyond the magnetic actuation market (Pt 1). With the three-wire, solid-state sensor, Cersell solves a rather simple but costly problem. In the North American market, a PNP type is prevalent and in the European market, […]
How do sensors for magnetic sensing applications work? Pt 1
At Sensors Expo 2019, Neil Cersell, President of the Cersell Company Inc., explains his company’s magnetic sensors that are available for magnetic actuation market. The magnetic actuators can be the round line ISO-6432 disposable style, a rectangular box style, tie-rod cylinders, short stroke clamp cylinders and even rotary actuators. All of these designs have a […]
What are the do’s and don’ts of sensor commercialization?
If you have a new sensor or sensor technology that you want to establish in the marketplace, getting some advice from industry experts could prevent you from making mistakes that others have made. The Micro, Nano and Emerging Technologies Commercialization Education Foundation (MANCEF) is an excellent source for experts in this area. MANCEF’s charter is […]
How can data loggers help ensure food and beverage safety?
Just about all areas of the food and beverage industry including commercial kitchens, transportation, storage or food service, require temperature and often humidity monitoring to ensure that the product has been kept within an acceptable range to avoid contamination and bacteria growth. The technology requirements are essentially the same for the sensor in each of […]
What Dev Kits are Available for New Designs?
At Sensors Expo 2019, Marc Hervieu from STMicroelectronics explains different development kits that are available to help designers expedite their design efforts in several areas, including cellular, LoRa and cloud connectivity for the Internet of Things. Working with partners Verizon (ST SIM card) and Quectel (ST LTE modem), the ST Microelectronics / Verizon LTE-M IoT […]
What type of packaging exists for sensing pressure?
At Sensors Expo 2019, Tom Nguyen, CEO of DunAn Sensing, explains innovative packaging for silicon microelectromechanical systems (MEMS) pressure sensor die that does not sacrifice performance. To complement its stable silicon MEMS die, DunAn Sensing is investing in packaging that takes advantage of the stability and adds flexibility without giving up performance in the package. […]
How can you sense tilt to control a robotic arm?
At Sensor Expo 2019, Devon Brock, Manager of Product Knowledge for the Sensor Group within TE Connectivity explains the DOG2 microelectromechanical systems (MEMS) -based inclinometer used to control a robotic arm. The two-axis tilt sensor provides ±90-degree measurements in the x and y axes. In the robotic arm, the inclinometer with its built-in electronic provides […]
How does a finger unlock a door?
At Sensor Expo 2019, Marcia Ratton from TDK InvenSense demonstrates how the UltraPrint Sensor (TCFS-3000) precisely identifies a finger print. Integrated into a door lock, the image from the sensor is displayed on a screen to demonstrate the clarity and details of the image. The ultrasonic fingerprint imaging uses proprietary InvenSense, a TDK Group company, […]
What does complete predictive machine maintenance look like?
At Sensor Expo 2019, Edoardo Gallizio from product marketing for MEMS & Sensors in the Americas at STMicroelectronics demonstrates a complete predictive maintenance reference design. Multiple sensors are part of the monitoring where some sensors are mounted directly on a spinning wheel to continuously measure vibration. The sensors gather the data, a microprocessor accesses the […]
What happens when the earth moves?
At Sensors Expo 2019, Satya Dixit from Applications and Systems Engineering at Rohm Semiconductor explains the capabilities and applications for an earthquake sensor module. The earthquake detection module (BP3901) has correctly detected 200 out of 205 previous cases of seismic events. Waveform differences between a seismic event and an external event such as a collision […]
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