Keysight Technologies, Inc. announces that the RFPro electromagnetic (EM) simulation software, part of the Keysight EDA Advanced Design System (ADS) integrated tool suite, is now certified by Intel Foundry for design engineers targeting Intel 18A process technology. The new EM simulation capability, together with process design kits (PDKs) for the Intel 18A circuit and physical designs, enables radio frequency integrated circuit (RFIC) […]
Wire-to-board connector line now includes branch connector
Hirose has expanded its low-profile DF51 wire-to-board connector series to include a branch connector. The DF51B Series enables the splitting of the cable into two separate paths. This not only simplifies the design and wiring process but also enables smaller and lighter end-products. Part of the SignalBee connector family, the 2.0 mm pitch DF51B Series […]
MEMs OCXO targets precision timing for aerospace & defense
SiTime Corporation announced its Endura Epoch Platform built for robust and resilient positioning, navigation and timing (PNT) services critical in defense operations. The ruggedized MEMS oven-controlled oscillator (OCXO) boosts the resilience of PNT systems and other equipment, such as radars, field and airborne radios, satcom terminals, and avionics against spoofing, jamming, and other disruptions in Global […]
IP engine integrated into RoT or embedded secure element in SoCs and FPGAs
Rambus Inc. announced the availability of a Quantum Safe Engine (QSE) for integration into hardware security elements in ASICs, SoCs, and FPGAs. Quantum computers will enable adversaries to break current asymmetric encryption, placing important data and assets at risk. The Rambus QSE IP core uses NIST-selected quantum-resistant algorithms to protect valuable data centers and government hardware […]
Board-to-board connectors pass 16 Gb/sec digital signals
Hirose has expanded its DF40 board-to-board floating connector series to support PCI-ex Gen.4 (16Gbps) and MIPI D-PHY Ver.1.1 (1.5Gbps). The DF40F Series provides high-density mounting, significant space-savings, and high-temperature resistance to 125 degrees for automotive applications. The DF40F Series is most commonly used in in-vehicle sensor applications including cameras, LIDAR, millimeter-wave radar, and more. Simplifying […]
Wireless module adds 5G, Wi-Fi 6E, and Bluetooth for all-around connectivity
Quectel Wireless Solutions announces the new Quectel SG520B series of 5G Sub-6GHz, Wi-Fi 6E, and Bluetooth smart modules. The module series has been developed to meet growing needs for smart modules that can support not only connectivity but also a variety of functions, such as edge computing capability, graphics processing, multimedia, and operation of peripherals…
Fiber optical rotatory joints for installation in tight spaces
Orbex Group announces its 700 Series of fiber optic rotary joint (FORJ) assemblies, supporting either single- or multi-mode operation with options for wavelengths of 1310 or 1550 nanometers. Both the 1310- and 1550-nanometer options feature an outer diameter of 7 millimeters for installation in tight spaces. Additionally, each FORJ assembly features an insertion loss of […]
Motor driver for BLDC applications provide full torque at zero speed
Renesas Electronics Corporation introduced a family of motor driver ICs for brushless DC (BLDC) motor applications. The devices implement Renesas’ new, patent-pending technologies that enable full torque at zero speed from motors without sensors, an industry first. The new motor driver ICs enable Renesas customers to design sensorless BLDC motor systems with higher horsepower and […]
10 MBd optocouplers provide low power consumption in industrial applications
Vishay Intertechnology, Inc. introduced five new 10 MBd high-speed optocouplers that provide low power consumption to save energy in industrial applications. Featuring a wide voltage supply range of 2.7 V to 5.5 V and an open collector output, the single-channel VOH260A, VOIH060A, and VOWH260A, and dual-channel VOH263A and VOIH063A enable usage with low voltage microcontrollers and I²C and SPI bus systems. Offered […]
Power modules now available with press-fit terminals
Microchip Technology announces its expansive portfolio of SP1F and SP3F power modules are now available with Press-Fit terminals for high-volume applications. Solder-free Press-Fit power module terminals allow for automated or robotic installation, which simplifies and speeds up the assembly process to reduce manufacturing costs. The high accuracy of the terminal locations and the novel Press-Fit pin design […]