Digi-Key Electronics announced that it has expanded its product portfolio to include Phase Dock Inc.’s WorkBench project development kit. This distribution partnership is part of Digi-Key’s Marketplace initiative to broaden the product offerings now available for customers, making Digi-Key more of a one-stop-shop than ever before. Phase Dock offers a unique project development kit series, the Phase […]
Aluminum electrolytic caps feature high CV product, high ripple current capability
TDK Corporation presents the new EPCOS aluminum electrolytic capacitor series B43647* with snap-in terminals. Thanks to their outstandingly high CV product, they are ideal for highly compact solutions in power electronics. The capacitors are designed for a maximum operating temperature of 105°C; at a rated voltage of 450 V DC and maximum ripple current, they […]
Matching service optimizes GSM-900, WiFi, Bluetooth, GPS/GNSS, ZigBee, 4G/LTE antenna placement
Würth Elektronik now offers developers wanting to use WE-MCA series chip antennas a free matching service. WE-MCA are compact SMT-mountable multilayer ceramic chip antennas available in numerous single and dual-band versions. The antennas, therefore, provide a space-saving solution for GSM-900, WiFi, Bluetooth, GPS/GNSS, ZigBee or 4G/LTE enabled devices and facilitate compact designs for IoT and smart […]
Chip design software works with 3-nm gate-all-around process technology
Synopsys, Inc. announced the release of the 3-nanometer (nm) gate-all-around (GAA) AMS Design Reference Flow, which provides designers a complete front-to-back design methodology for designing analog and mixed-signal circuits using the Synopsys Custom Design Platform. It has been optimized to provide maximum designer productivity for designers of advanced 5G, HPC, AI, and IoT applications using the Samsung 3nm […]
PCIe boards carry accelerator ICs to speed AI inference for edge systems
Flex Logix Technologies, Inc. announced the availability and roadmap of PCIe boards powered by the Flex Logix InferX X1 accelerator – the industry’s fastest and most efficient AI inference chip for edge systems. The InferX X1P1 uses a single InferX X1 chip and a single LPDDR4x DRAM on a half-height, half-length PCIe board. Samples are […]
Embedded FPGA IP works on 28-nm FD–SOI-based ICs
QuickLogic Corporation announced the availability of its ArcticPro 3 embedded FPGA (eFPGA) IP, which is now available on Samsung’s 28nm FD–SOI process, enabling OEMs and semiconductor companies to seamlessly integrate the capability of discrete FD-SOI FPGAs into their own ASICs/SoCs, greatly optimizing system performance, power consumption and cost for Edge AI use cases in consumer, IoT, and automotive […]
Development platform speeds 2K high-resolution imaging radar work
Arbe announced the rollout of their Radar Development Platform empowering customers to revolutionize their imaging radar systems. Tier 1s, OEMs, and new mobility players are enhancing their perception algorithms based on the 2K high-resolution Imaging Radar Development Platform, or A Sample as referred to in the automotive industry. Arbe is currently collaborating with over 20 tier-1 and OEM […]
Development kit focuses on Arduino-based, LTE-powered IoT apps
Telit announced the launch of Charlie, a turnkey innovation kit for fast, inexpensive development of Arduino-based, LTE-powered IoT applications. The new kit is the latest example of Telit’s commitment to providing makers and other innovators with low-cost development solutions as they explore the burgeoning IoT market opportunity. Telit designed Charlie to provide all of the key features […]
SoM sports hardened 64-bit, multicore RISC-V MPU subsystem
Sundance has launched PolarBerry, the first production and deployment-ready SoM with a hardened 64 bit, multicore real-time, Linux-capable RISC-V MPU subsystem to deliver an unparalleled combination of defense-grade security, low power consumption, and thermal efficiency for embedded systems development. With Microchip Technology Inc.’s PolarFire SoC field-programmable gate array (FPGA) at its heart, providing a deterministic, […]
Reference design covers IO-Link transceivers
Modern smart factories need to quickly and remotely adjust a sensor’s electrical characteristics to minimize downtime and maximize throughput. The MAXREFDES177# IO-Link reference design from Maxim Integrated Products, Inc. demonstrates the flexibility of the MAX22515 IO-Link transceiver, seamlessly configuring all modes of the MAX22000 software-configurable analog IO. This chipset provides flexibility with faster reconfiguration to reduce factory downtime. Maxim Integrated’s […]
