Save at least six months of development time using the Health Sensor Platform 3.0 (HSP 3.0) from Maxim Integrated Products, Inc. Also known as MAXREFDES104#, this ready-to-wear wrist form factor reference design monitors blood oxygen saturation (SpO2), electrocardiogram (ECG), heart rate (HR), body temperature, and motion. Included algorithms provide HR, heart-rate variability (HRV), respiration rate […]
Multiprotocol wireless modules boast full-stack support for IoT apps
Silicon Labs announced a portfolio expansion of pre-certified wireless modules specifically designed to address the modern needs of IoT application development. The portfolio consists of the only modules in the industry with full-stack support for multiprotocol solutions to enable commercial and consumer IoT applications, with flexible package options and highly integrated device security. Silicon Labs […]
Low-cost power modules target motor control, ATE, medical, imaging apps
RECOM has partnered with a global OSAT company (Outsourced Semiconductor Assembly and Test) to extend its range of low-cost power modules. The RPX-1.0 and RPX-1.5 buck converters in miniature, thermally-enhanced 3mm x 5mm QFN packages with 1.6mm profile and feature innovative 3D power packaging technology. Construction is over-molded ‘Flip Chip on Leadframe’ (FCoL) with an integrated, […]
Motor-control MCUs include AI-based failure detection, predictive maintenance
Renesas Electronics Corporation announced the extension of its microcontroller (MCU) portfolio designed for motor control applications targeting smart homes, industrial automation, and building automation. Featuring a rich set of peripheral functions and AI-based failure detection, the four new RA6T1 Group MCUs are the latest members of Renesas’ rapidly expanding Arm-based RA Family, and the first […]
Tiny MEMs resonators integrate load capacitors
SiTime Corporation announced that it has entered the $2 billion precision resonator market with the ApexMEMS family of MHz resonators. These new devices are the third-generation of SiTime silicon MEMS technology and are available in a variety of MHz frequencies for high-volume electronics. Mobile and IoT applications such as Bluetooth wearables and wearables, high-speed connectivity […]
LoRaWAN TS1-1.0.4 Spec simplifies development, deployment, Interoperability
The LoRa Alliance announced that it published the LoRaWAN TS1-1.0.4 Link Layer (L2) Specification. This latest definition of the LoRaWAN standard includes all required implementation elements to facilitate LoRaWAN deployments globally. According to industry research firm IoT Analytics, LoRaWAN is the most adopted LPWAN technology to date, representing more than one-third of all deployments globally. This market […]
Adaptive radio platforms designed to meet evolving 5G NR wireless standards
Xilinx, Inc. introduced ZynqRFSoC DFE, a breakthrough class of adaptive radio platforms designed to meet the evolving standards of 5G NR wireless applications. Zynq RFSoC DFE combines hardened digital front-end (DFE) blocks and adaptable logic to build high performance, low power, and cost-effective 5G NR radio solutions for a broad array of use cases ranging […]
LCD controllers handle resolutions from VGA to 4k UHD with 10-bit color
DATA MODUL Inc. offers with its eMotion product line state-of-the-art LCD controller boards, which are specially tailored to the high-performance requirements of industrial customers. All boards are developed by Data Modul’s in-house R&D department and manufactured in Germany, offering the highest quality, product stability, and long-term availability. Thanks to its wide selection, the eMotion family […]
Multi-zone, direct Time-of-Flight modules speed scene comprehension efforts
STMicroelectronics has extended its portfolio of FlightSense Time-of-Flight (ToF) sensors with the world’s first 64-zone device that breaks a scene into separate areas to help an imaging system build the most detailed spatial understanding of a scene. This first-of-its-kind product comprises a 940nm Vertical Cavity Surface Emission Laser (VCSEL) light source, a System-on-Chip sensor integrating a VCSEL driver, […]
Plug-and-play boards control 3-phase BDCMs powered from Li-ion batteries
STMicroelectronics has introduced two new plug-and-play boards for controlling 3-phase brushless motors powered by up to 56V Li-ion batteries. Based on ST’s highly integrated STSPIN32 motor-control Systems-in-Package, the STEVAL-PTOOL1V1 and STEVAL-PTOOL2V1 evaluation boards fulfill key requirements of power tools including small dimensions and low standby current. Firmware is supplied for six-step motor commutation using Hall-effect rotor-position sensing, which […]
