Tallysman Wireless Inc. is announcing the low-profile triple-band HC997EXF to its industry-leading line of embedded helical GNSS antennas. The triple-band GNSS HC997EXF embedded helical antenna is designed for precise positioning, covering the GPS/QZSS-L1/L2/L5, GLONASS-G1/G2/G3, Galileo-E1/E5a/E5b, BeiDou-B1/B2/B2a, and NavIC-L5 frequency bands, including the satellite-based augmentation system (SBAS) available in the region of operation [WAAS (North America), EGNOS (Europe), MSAS […]
Current-sensing foil-on-ceramic resistors sport 2 milliohm resistance
High efficiency in consumer electronics has become increasingly important. For portable electronics, this means lower resistance values on current sense resistors for battery and power management. Stackpole’s CSRF series is a foil on ceramic carrier chip resistor that is designed for these applications. The CSRF2512 is now available in resistance values down to 2 milliohms. […]
Gap filler pads offer performance of 3.2 W/m-K thermal conductivity
Parker Hannifin Corporation announced the launch of THERM-A-GAP PAD 30 and THERM-A-GAP PAD 60, the next generation of thermally conductive gap filler pads from Parker Chomerics. With the performance of 3.2 W/m-K thermal conductivity, THERM-A-GAP PAD 30 reliably conforms to rough surface irregularities and air gaps on heat-generating components. For higher performance applications, THERM-A-GAP PAD […]
Economical dc cooling fans work at up to 48 V
CUI Devices’ Thermal Management Group announced the recent expansion of its dc fans and blowers product line with the addition of over 30 new series and over 500 new SKUs. These highly economical models include a range of sleeve bearing and ball bearing options as well as CUI Devices’ omniCOOL bearing system that provides enhanced longevity and performance compared […]
Versatile 6.5-in TFT display modules offer high optical performance
Display solutions and Review Display Systems (RDS) announced the availability of a new Tianma 6.5-inch TFT display module. The P0650VGF1MA00 features SFT (Super Fine TFT) technology which ensures exceptional optical performance, a 4:3 classic aspect ratio, and VGA (640 x 480 pixels) resolution. Tianma P-series displays are designed to provide reliable and consistent operation when […]
Machine learning platform supports long short-term memory quantization
Imagimob announced that its tinyML platform Imagimob AI supports quantization of so-called Long Short-Term Memory (LSTM) layers and a number of other Tensorflow layers. LSTM layers are well-suited to classify, process, and make predictions based on time series data, and are therefore of great value when building tinyML applications. The Imagimob AI software with quantization […]
Chipset handles 48-V DC-DC conversion in high-density computing, BLDC motor drives
EPC announces the introduction of a 100 V, 65 A integrated circuit chipset designed for 48 V DC-DC conversion used in high-density computing applications and in 48 V BLDC motor drives for e-mobility, robotics, and drones. The EPC23101 eGaN IC plus EPC2302 eGaN FET offers a new ePower Chipset capable of a maximum withstand voltage […]
Power integrity analysis software handlesTSMC N7, N5 process technologies
Siemens Digital Industries Software announced that its new mPower solution for power integrity analysis of analog, digital, and mixed-signal IC designs is now certified for TSMC’s N7 and N5 process technologies. The significant power and performance advancements of TSMC’s N7 and N5 processes make them ideal for next-generation mobile, artificial intelligence, high-performance computing, and network […]
Ultra-low power MIPI D-PHY(SM) IPworks on 12-nm FinFET process node
Arasan Chip Systems announces the immediate availability of its redesigned 2nd generation MIPI D-PHYSM IP for the GlobalFoundries 12nm FinFET process node. Arasan is a partner of GlobalFoundries, and multiple test chips have been sponsored by GlobalFoundries in an effort to make Arasan’s IP silicon-proven and available for the GlobalFoundries 12nm process. This 2nd generation […]
Wireless power supply chipset provides up to 1 W
ROHM Group company LAPIS Technology announced they have developed a chipset capable of providing up to 1W of wireless power for compact, streamlined wearable devices and for industrial smart, miniaturized, and sealing solutions. The ML7661 (transmitter) and ML7660 (receiver) eliminate the need for an external MCU by incorporating a control circuit required for transmission/reception, resulting in the industry’s smallest […]