Nexperia announced the industry’s first 80 V RET (Resistor-Equipped Transistor) family. These new RETs or ‘digital transistors’ provide enough headroom for use in 48 V automotive board net (e.g. mild hybrid and EV cars) and other higher voltage circuits which are often subject to large spikes and pulses that previous 50 V parts cannot handle. […]
Single-/multi-cell solar harvester increases runtime in wearable and IoT applications
Designers of space-constrained designs can now significantly increase runtime with the MAX20361 single-/multi-cell solar harvester with maximum power point tracking (MPPT) from Maxim Integrated Products, Inc. . The industry’s smallest solar harvesting solution is ideal for space-constrained applications such as wearables and the emerging internet of things (IoT) applications. Designers are often challenged with the […]
Eval kit helps wring out single-pair high-speed digital subscriber line apps
With the SHDSL standard, data can be transmitted over extremely long copper cables. This makes this technology the first choice in applications where Power over Ethernet and DSL technologies like G.FAST, VDSL are not possible. With its SHDSL Evaluation Kit, Würth Elektronik now offers developers the possibility to test applications with the SHDSL transceiver from Intel. […]
SoC development platform handles MCVP automotive work
Renesas Electronics Corporation announced its collaboration with Microsoft to accelerate the development of connected vehicles. Renesas’ R-Car Starter Kit, based on Renesas’ R-Car automotive system-on-chip (SoC), is now available as a development environment for the Microsoft Connected Vehicle Platform (MCVP)<https://www.microsoft.com/industry/automotive/connected-vehicles>. MCVP combines a partner ecosystem with a horizontal platform of Azure cloud, AI, and edge […]
Free firmware upgrade brings MQTT IIoT support to PLC CPUs
IDEC Corporation has released a free firmware upgrade enabling new and existing MicroSmart FC6A Plus PLC CPUs to support the industry-standard MQTT protocol. The upgrade can be downloaded to the FC6A CPU, so it is easy for users to connect all types of field data to on-site and cloud-based brokers, and make the information readily […]
Half-bridge PCBs help evaluate GaN drivers, transistors
GaN Systems announced the release of two 650V half-bridge daughter cards (30A and 60A), which provide an ultra-versatile platform to evaluate GaN drivers and transistors. The evaluation cards are available in two power levels, up to 3kW (GS-EVB-HB-66508B-RN) and up to 6kW (GS-EVB-HB-66516T-RN), and include the Renesas RAA226110 low-side GaN FET driver. These cards are the industry’s […]
High-rez automotive viewing camera ICs add cybersecurity features
OmniVision Technologies, Inc. announced during CES the OX03F10 automotive image sensor. This sensor expands OmniVision’s next-generation ASIL-C viewing camera family with higher 3MP resolution and cybersecurity features that are required as vehicle designers make the transition from Level 2 and 3 advanced driver assistance systems (ADAS) to higher levels of autonomy. The OX03F10 also maintains the family’s unique […]
MEMS motion sensor/software combo targets smart TV, robotics, AR/VR, wearables, IoT apps
TDK Corporation announces the availability of the InvenSense ICM-40627 and ICM-42688-V high-performance MEMS motion tracking solutions (6-axis IMU + dedicated software library). As a leader in consumer IoT, TDK continues to provide a complete suite of SmartMotion sensor solutions for a broad range of consumer and IoT applications. In addition, a comprehensive development platform, the […]
Low-power MEMS barometric pressure sensor targets drone, IoT apps
TDK Corporation announces the InvenSense ICP-20100 platform, the latest technology advancement in the SmartPressure product family. The ICP-20100 is a barometric pressure sensor based on MEMS capacitive technology, improving our lead in the development of ultra-low noise at the lowest power and progressing our industry-leading relative accuracy, sensor throughput, and temperature stability. The ICP-20100 achieves […]
Low-power microphones include wake-on-sound feature
TDK Corporation introduces the InvenSense T5838, the latest technological breakthrough in the SmartSound product family. The T5838 is the world’s lowest power Pulse Density Modulation (PDM), multi-mode MEMS microphone with high AOP and high SNR for smartphones, microphone arrays, smart speakers, IoT, and other consumer devices. The microphone offers an exceptionally efficient 130 µA ultra-low […]
