• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar
  • Skip to footer

Electrical Engineering News and Products

Electronics Engineering Resources, Articles, Forums, Tear Down Videos and Technical Electronics How-To's

  • Products / Components
    • Analog ICs
    • Connectors
    • Microcontrollers
    • Power Electronics
    • Sensors
    • Test and Measurement
    • Wire / Cable
  • Applications
    • Automotive/Transportation
    • Industrial
    • IoT
    • Medical
    • Telecommunications
    • Wearables
    • Wireless
  • Resources
    • DesignFast
    • Digital Issues
    • Engineering Week
    • Oscilloscope Product Finder
    • Podcasts
    • Webinars / Digital Events
    • White Papers
    • Women in Engineering
  • Videos
    • Teschler’s Teardown Videos
    • EE Videos and Interviews
  • Learning Center
    • EE Classrooms
    • Design Guides
      • WiFi & the IOT Design Guide
      • Microcontrollers Design Guide
      • State of the Art Inductors Design Guide
      • Power Electronics & Programmable Power
    • FAQs
    • Ebooks / Tech Tips
  • EE Forums
    • EDABoard.com
    • Electro-Tech-Online.com
  • 5G

Broadband Briefs for 2/18/10

February 18, 2010 By ECN Staff

• Enablence adds 10 GigE options
By Brian Santo

Enablence Technologies is increasing the bandwidth capabilities of its fiber-optic delivery platforms with the addition of 10 Gigabit Ethernet modules that can be ganged together to provide transport in excess of 10 Gbps.

The new Fabric Modules work with the company’s Magnm Multi Media Aggregation Node and Trident7 Universal Access Platform. These fully redundant, non-blocking modules are optimized for FTTx applications where multiple 10 Gigabit Ethernet transport links are required. They provide a 10X performance increase over the current Magnm and Trident switch modules and can be deployed in any Magnm and Trident already in service, the company said.

Magnm is Enablence’s fully distributed IP/Ethernet-based multi-service access platform purpose-built for broadband access and aggregation. The new Magnm switching module, the F-8208, is available in two versions. One provides two 10 Gigabit Ethernet uplinks, while the other supports four 10 Gigabit Ethernet uplinks. Both support six 1 Gbps Ethernet SFP ports and four 10/100/1000 Mbps Ethernet RJ-45 ports. All uplinks can be used individually or can be trunked together using standards-based link aggregation to form an even higher-speed virtual link, cost-effectively increasing transport capacity well beyond 10G, the company said.

The Trident7 is an IP/Ethernet-based system that supports all three major FTTH implementation standards: ITU G.984 GPON, IEEE 802.3 GE-PON (EFM PON) and IEEE 802.3 Point-to-Point. The T7-PSM-02 supports three 10 Gigabit Ethernet uplinks and two 1 Gigabit Ethernet uplinks. All uplinks can be used individually or can be trunked together.

• AT&T does a Backflip for Android
By Andrew Berg, Wireless Week

Motorola BACKFLIPAT&T today confirmed details for the carrier’s first Android smartphone, the Motorola Backflip. Unveiled in January at the annual Consumer Electronics Show, the Backflip sports an unorthodox “reverse flip” form factor, with keyboard and unique Backtrack touch panel located behind the screen for navigation of the device.

The Backflip also includes Motoblur, Motorola’s proprietary social networking UI. Motoblur allows users to sync Facebook, MySpace, Twitter, Gmail, Picasa and other accounts with their contacts. The UI threads status updates, as well as profile photos, through calls, e-mails and their address book.

Additional specs for the phone include a 3.1-inch high-res touchscreen display, 5 megapixel camera with flash, HSPA 7.2 connectivity and access to AT&T’s 20,000 Wi-Fi hotspots at no additional cost.

The Backflip will be available in retail stores nationwide and online on March 7. The phone will sell for $99.99 with a two-year contract after a $100 mail-in rebate. AT&T emphasized its commitment to expanding its device portfolio this week at Mobile World Congress. In addition to adding Android devices, the carrier said that it will offer devices that run the new Microsoft Windows 7 series platform.

More Broadband Direct 2/18/10:
•  CED Blog: Shaw gears up for Gigabit Internet, RFoG trials
•  Comcast Spotlight bullish on addressable ad trial
•  Sezmi becomes a TV service provider
•  N.J. school district saves cash with Optimum Lightpath
•  TWC pouring cash into college research
•  Comcast names Hansen VP of business services for West Division
•  Charges drag DirecTV to Q4 loss
•  Verizon FiOS customers to get online access to HBO
•  5 vendors to take part in SCTE Canadian Summit’s Innovation Showcase
•  Sigma Systems allies with TMNG 
•  Windstream’s Q4 profit falls 7% as revenue slips
•  Yahoo, Microsoft to begin their Web ad partnership 
•  Broadband Briefs for 02/18/10

 

Filed Under: Uncategorized

Primary Sidebar

EE Training Center Classrooms.

EE Classrooms

Featured Resources

  • EE World Online Learning Center
  • RF Testing Basics
  • Power Supply Fundamentals
  • Women in Engineering
  • R&D 100 Podcast
Search Millions of Parts from Thousands of Suppliers.

Search Now!
design fast globle

R&D World Podcasts

R&D 100 Episode 8
See More >

Current Digital Issue

June 2022 Special Edition: Test & Measurement Handbook

A frequency you can count on There are few constants in life, but what few there are might include death, taxes, and a U.S. grid frequency that doesn’t vary by more than ±0.5 Hz. However, the certainty of the grid frequency is coming into question, thanks to the rising percentage of renewable energy sources that…

Digital Edition Back Issues

Sponsored Content

New Enterprise Solutions for 112 Gbps PAM4 Applications in Development from I-PEX

Positioning in 5G NR – A look at the technology and related test aspects

Radar, NFC, UV Sensors, and Weather Kits are Some of the New RAKwireless Products for IoT

5G Connectors: Enabling the global 5G vision

Control EMI with I-PEX ZenShield™ Connectors

Speed-up time-to-tapeout with the Aprisa digital place-and-route system and Solido Characterization Suite

More Sponsored Content >>

RSS Current EDABoard.com discussions

  • Regarding Induction Heating From Low Voltage DC
  • [moved] Question to Forum moderators - When to start new thread
  • Help designing 1.6KW Isolated AC/DC with Constant Current Output
  • Variable Frequency and Amplitude Oscillator Circuit
  • Reducing switching noise in MOSFET inverter

RSS Current Electro-Tech-Online.com Discussions

  • Light Automation via mqtt
  • uc3843 Buck-boost
  • How to power up two stereo audio amplifiers from a single source of power supply
  • Nokia 5110 HW in Oshonsoft
  • Drill speed controller fault

Oscilloscopes Product Finder

Footer

EE World Online

EE WORLD ONLINE NETWORK

  • 5G Technology World
  • Analog IC Tips
  • Battery Power Tips
  • Connector Tips
  • DesignFast
  • EDABoard Forums
  • Electro-Tech-Online Forums
  • Engineer's Garage
  • Microcontroller Tips
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips
  • Wire & Cable Tips

EE WORLD ONLINE

  • Subscribe to our newsletter
  • Lee's teardown videos
  • Advertise with us
  • Contact us
  • About Us
Follow us on TwitterAdd us on FacebookConnect with us on LinkedIn Follow us on YouTube Add us on Instagram

Copyright © 2022 · WTWH Media LLC and its licensors. All rights reserved.
The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media.

Privacy Policy