Software-defined radio addresses problems and limitations found in hardware-based radios, such as hardware obsolescence and rigidity.
5G
Learn these five basic RF measurements
Basic RF measurements go a long way toward characterizing today’s communication systems.
Serial bus exerciser, protocol analyzer handle interface development tasks
Prodigy Technovations Pvt. Ltd introduces PGY-QSPI-EX-PD, PGY-SMI-EX-PD, PGY-SMBus-EX-PD, and PGY-JTAG-EX-PD. These serial bus Exercisers and Protocol Analyzers are for the development of interfaces for consumer, automotive, and 5G applications. PGY-EX-PD is a family of leading instruments that enables the design and test engineers to test the QSPI, SMI (MDIO), SM Bus, and JTAG designs for its specifications by configuring […]
Exfo rejects another Viavi takeover bid
Communications test-equipment choices would get still fewer if Exfo’s board accepts an offer, but that’s highly unlikely.
IMS 2021: Components to test equipment
A hybrid International Microwave Symposium (IMS) took place live in Atlanta and online two weeks later in June 2021. See a selection of companies and product — mostly 5G — showcased in the virtual version.
Why voice over 5G relies heavily on LTE
Mobile phones are still phones. 5G devices need the ability to fall back to LTE when network support isn’t available. Here’s how and why.
Amplifiers drive mixers and multipliers
The AMM-7199 and AMM-7200 series from Marki Microwave drive downstream components in mmWave RF systems
5G and COVID-19 changed semiconductor test
In this video, 5G Technology World spoke with Marvin Test CEO Steve Sargeant about how the company adapted to mass production of mmWave devices and how the pandemic changed its methods of technical support.
5G mmWave brings PCB manufacturing challenges
5G can be up to 100 times faster than 4G with 100 times higher data capacity and latency of under one millisecond. What does this mean for PCBs?
Add UWB hardware and software to IC designs
CEVA’s Riviera Waves IP lets you add an Ultra-Wideband digital PHY and hardware/software MAC layer to an IC design for use in low-power devices.