Infineon Technologies AG introduces a new CoolSiC technology: the CoolSiC MOSFET 1200 V M1H. The advanced silicon carbide (SiC) chip will be implemented in a widely extended portfolio using the popular Easy module family, along with discrete packages using.XT interconnect technology. The M1H chip offers high flexibility and is suitable for solar energy systems, such […]
Automotive/Transportation
Software helps speed LiDAR sensor development
LeddarTech announces the availability of a completely new version of the LeddarEngine software to enable and accelerate LiDAR sensor development. The LeddarEngine sets a new standard for developing highly integrated and flexible solid-state LiDAR solutions optimized for high-volume production. This complete solution comprises the LeddarCore LCA3 system on chip (SoC) and LeddarSP signal processing. This new version […]
Power integrity analysis software certified for GF platforms
Siemens Digital Industries Software announced that its new mPower Digital solution for power integrity analysis of analog, digital, and mixed-signal IC designs is now certified for digital analysis of designs using GlobalFoundries’ (GF) platforms. The significant power and performance advancements of GF’s feature-rich platforms, equipped with advanced features such as RF, automotive, ultra-low-power memory, and […]
MLCCs handle 150℃ for automotive apps
Samsung Electro-Mechanics announced on the 11th that it has developed 13 types of automotive MLCCs with guaranteed use in a 150℃ environment with plans to supply them to global auto parts manufacturers. High-reliability automotive MLCCs with guaranteed use at 150℃ have been produced only by some companies, but with this development, Samsung Electro-Mechanics will step up […]
Solid-state laser arrays target sensing apps
Lumentum Holdings Inc. announced the M Series multi-junction VCSEL arrays for next-generation automotive, industrial LiDAR, and 3D sensing applications and the availability of the first M Series product, the M51-100 905 nm 70 W multi-junction VCSEL array. Lumentum’s automotive qualified, high-performance M Series features peak powers suited for short- and long-range advanced mobility and industrial LiDAR applications. […]
Y2 capacitors optimized for high temperature
TDK Corporation presents a new series of EPCOS MKP-Y2 capacitors for interference suppression. In contrast to conventional models designed for a maximum operating temperature of 110°C, the new capacitors offer a maximum permissible operating temperature of 125 °C. The B3202* H/J series’ capacitance ranges from 1 nF to 1 µF with a maximum rated voltage […]
Realizing the potential of 5G: the critical role of connectors
Contributed by Paul Pulkowski, Marketing Manager; Maciek Czerwinski, Director of Sales and Business Development; and Rick Lopez, Sales Engineer and Project Manager, binder USA The potential of 5G connectivity is nearly limitless with statistics that are difficult to imagine. Analysts predict that worldwide 5G connections will double in 2022 to 1.34 billion, and grow to […]
Hall switches feature ASIL B safety ratings
TDK Corporation has upgraded its Micronas Hall-effect switch family, HAL 15xy, for automotive and industrial applications – All now defined as SEooC (Safety Element out of Context) ASIL B-ready, according to ISO 26262. Modules equipped with HAL 15xy can more easily fulfill higher safety criteria in automotive applications such as brake fluid level sensing, seat […]
Reference design combines AI and privacy
Lumentum Holdings Inc. and Ambarella, Inc. announced a new joint reference design that uniquely combines edge artificial intelligence (AI) with privacy, enabling new possibilities for smart building applications. Called Vision-D, this groundbreaking design combines Lumentum’s flood illuminator module for extremely accurate time-of-flight (ToF) 3D sensing, with Ambarella’s CV22 edge AI SoC, which provides industry-leading AI […]
How are ultrasonic MEMS sensors being used for 3D obstacle detection and collision avoidance?
In addition to radar, LiDAR and camera sensing used in 3D obstacle detection and collision avoidance in advanced driver assistance systems (ADAS) in vehicles, ultrasonic sensing has been used as well. Traditionally, the ultrasonic sensors used transducer-based technology to provide a microphone to transmit and receive the ultrasonic signal in passenger vehicle parking applications. Using Infineon’s […]
