Efficient Power Conversion Corporation (EPC) announces the availability of the EPC9086 development board, a high-efficiency half-bridge development board that can operate up to 10 MHz. The EPC9086 board measures 2” x 2” and contains a 30 V, 15 A EPC2111 enhancement-mode gallium nitride half bridge in combination with the recently introduced PE29102gate driver from Peregrine Semiconductor. The purpose of this […]
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RNCS kits for prototyping precision anti-moisture applications
Stackpole Electronics, Inc. offers engineering sample kits for their popular RNCS Series of anti-moisture thin film chip resistors. The RNCS0603BKE kit offers 20 pieces each of the 45 most popular 0603 values ranging from 49.9 ohms up to 249K in 0.1% tolerance and 25 ppm TCR. The RNCS0805BKE kit offers 20 pieces each of the […]
Camera module boosts processing power of 3D sensing applications
CEVA, Inc. announced today a partnership with LG Electronics to deliver a high-performance, low-cost smart 3D camera solution for consumer electronics and robotic applications with a 3D camera module incorporates a Rockchip RK1608 coprocessor with multiple CEVA-XM4 imaging and vision DSPs. The DSPs provide the processing power to perform a wide variety of 3D sensing applications. […]
Power adapters meet DoE Level VI/COC Tier 2 standards
Artesyn Embedded Technologies announced three new series of external power adapters to enable original equipment manufacturers (OEMS) to meet the Department of Energy Level VI and European Code of Conduct (CoC) v5 Tier 2 Directive efficiency standards. These standards aim to reduce waste energy from external power supplies both from no-load and normal operation and […]
MEMS pressure sensor dies feature 0.65-sq-mm footprint
The automotive versions of the C33 series of miniaturized EPCOS MEMS pressure sensor dies from TDK Corporation are sized at 1 mm x 1 mm x 0.4 mm They are designed for absolute pressures of 1.2 bar to 10 bar, and are qualified based on AEC-Q101. The typical operating voltage is 3 V. With a supply voltage of 5 V they offer sensitivities […]
USB Type-C reference design simplifies design of lithium ion battery packs
Silicon Labs has introduced a comprehensive reference design to simplify the development of USB Type-C rechargeable lithium-ion battery packs used to power smartphones, tablets, laptops, headphones and other portable devices. The reference design includes everything developers need to create dual-role port (DRP) applications with USB Type-C power delivery (PD), accelerating the development of new USB Type-C […]
Far-field linear mic array dev kit lets developers integrate Alexa into smart panels, appliances, commercial/industrial electronics
Developers looking to integrate Alexa into smart panels, kitchen appliances, and other commercial and industrial electronics can now access the VocalFusion 4-Mic Dev Kit for Amazon Alexa Voice Service (AVS) from XMOS Ltd. The kit features a compact four-microphone linear 100mm array. The captured voice signals are crystal clear even in noisy environments, enabling commands to […]
Demo kits for eGaN FETs cover wireless charging standards
Efficient Power Conversion Corporation (EPC) announces the availability of two new demonstration kits – the EPC9127, a complete wireless power kit including a 10 W, class 2 amplifier, category 3 receiver device and the EPC9128, consisting of a 16 W, class 3 amplifier and two receiver devices (categories 3 and 4). These systems, coupled with […]
4G LTE quad-core SoC includes WorldMode Cat4 modem, dual cameras, 18:9 display support
MediaTek Inc. introduced its MT6739 chipset today at India Mobile Congress 2017, the first mobile conference of its kind in the region. The high-speed quad-core System on Chip (SoC) is built for India’srapidly growing 4G market. The MT6739 features an advanced WorldMode LTE Cat.4 modem, dual camera photography and 18:9 display support to bring latest 4G LTE functions and […]
Power-line communication modem chipset supplied with certified G3-PLC/PRIME protocol stacks
STMicroelectronics announced its new modular Power-Line Communication (PLC) modem chipset. The chipset will provide more flexibility to manufacturers of utility meters, smart-grid nodes, streetlamps, and home and industrial controllers. Three leading global smart-meter manufacturers are already designing solutions based on this new platform. A turnkey solution, the chipset consolidates protocol handling to package and adapt data […]