Sequans Communications S.A. announced that its second-generation LTE Cat 1 chip platform, Calliope 2, will soon be sampling. Calliope 2 is designed for the cost-effective support of IoT applications that require VoLTE and a data rate higher than 100 kilobits per second that cannot be supported by LTE-M or NB-IoT technologies. Typical Calliope 2 applications […]
IoT
Power system design considerations for wireless IoT nodes and wearables – Virtual Roundtable (part 1)
The first part of EEWorld’s two-part “virtual roundtable” discussion on power system design considerations for wireless IoT nodes and wearables focuses on the use of low dropout regulators (LDOs). Our panelists are Kyle Van Renterghem, (KVR) Marketing & Applications Manager, Low Input Voltage LDOs, Texas Instruments, and Julian Hagedorn (JH), Systems Engineer, Texas Instruments. JS: […]
IoT module hosts LTE-optimized transceiver, SIM card, includes data plan
Sequans Communications S.A. introduced an LTE IoT module that offers device makers a quick and easy solution for connecting their IoT devices to the Orange LTE-M Network. The Monarch GMS01Q module, a third-generation module from the Orange Live Booster program, is based on Sequans’ industry-leading Monarch LTE-M/NB-IoT chip platform and includes an LTE-optimized transceiver and […]
Open standard module release defines postage-stamp-sized computer PCBs
SGET e.V. announces release 1.0 of the new OSM Computer-on-Module standard. OSM, which is short for Open Standard Module, defines one of the first standards for directly solderable and scalable embedded computer modules. It also marks a new milestone in the miniaturization of modular COM/carrier designs, replacing credit card-sized modules with postage-stamp-sized ones. The new […]
STM32 MCUs now run Azure RTOS, get source code access
STMicroelectronics has signed an agreement with Microsoft to simplify and accelerate the development of smart-appliance controllers and other Internet-of-Things (IoT) devices. Developers working with STM32 microcontrollers (MCU) can now leverage Microsoft Azure RTOS (Real-Time Operating System) to provide ready-to-use services for managing their application. Seamlessly connected to the STM32Cube development ecosystem, which consolidates tools and software to support customers’ projects from […]
MCUs target IoT apps, consume uA/MHz in active mode, 1.6 mA in standby mode
Renesas Electronics Corporation expanded its RA4 Series microcontrollers (MCUs) with the new 32-bit RA4M3 Group of MCUs. The RA4M3 MCUs boost operating performance up to 100 MHz using the Arm Cortex-M33 core based on Armv8-M architecture. Featuring industry-leading performance, Arm TrustZone technology, Renesas’ Secure Crypto Engine, and a suite of new memory enhancements, the RA4M3 Group […]
NB-IoT/LTE-M SiP, SoC module supports low-power, complex IoT connectivity
Leading global technology solutions provider Avnet expanded its product line for rapid Internet of Things (IoT) development with the launch of the AVT9152 module, designed for a range of embedded applications requiring cellular connectivity yet demanding low power consumption and minimal component size. This addition to the Avnet ecosystem uses leading technology from Nordic Semiconductor to […]
ROS now supports 64-bit processor cores
SEGGER has announced that its embOS real-time operating system now supports 64-bit processor cores. Today, most IoT implementations and other sophisticated embedded applications rely on 32-bit CPUs. In the very near future, however, they will start migrating to higher performance 64-bit CPUs. This is because the latest generation of SoCs and FPGAs with advanced peripherals […]
Battery life analysis and maximization for wireless IoT sensor nodes and wearables
In addition to proper hardware design and power consumption testing, an accurate estimation of battery life is an important aspect of designing wireless Internet of Things (IoT) sensor nodes and wearables. For some medical or industrial devices, in particular, users’ lives can be at stake if the battery does not live up to expectations. Some […]
COM-HPC carrier board includes interfaces for programming, firmware flashing, reset
Congatec introduces the first carrier board and cooling solutions building the foundation of the new ecosystem for the brand new PICMG COM-HPC standard. They are a major milestone for the COM-HPC integration and have been created to accelerate the utilization of congatec’s COM-HPC modules based on the latest 11th Gen Intel Core processors (code name […]