Digi International a leading global provider of machine-to-machine (M2M) and Internet of Things (IoT) connectivity products and services, today unveiled the innovative features and capabilities powering the newest Digi XBee Cellular modems. Digi will be introducing three new variants to its lineup: Digi XBee Cellular gen 2 modem designed for the AT&T Cat 1 cellular network, […]
IoT
PODCAST Dr. Marie Johnson: Innovator for and from the heart
It’s called the widow maker for a reason as Dr. Marie Johnson experienced when her 41-year old, seemingly healthy husband died suddenly from Coronary Artery Disease (CAD) — the number one killer among both men and women. And predicting a heart attack using standard risk factors is generally insufficient. Learn how Dr. Johnson went from […]
Fast serial interface RAM targets high-performance apps
Professional low power memory solution Fabless company JSC announced the industry’s fastest Octa serial interface RAM, the OctaRAM JSC64SS product family. OctaRAM provides designers with the next generation performance level of x8 I/O serial interface products with an operating frequency of up to 200MHz and transmission speeds of up to 400MB/s. This world class leading performance […]
Industry 4.0: Interweaving manufacturing and technology for a Smart Factory
(Adapted from the white paper, Data Digital Threads and Industry 4.0) In 2007, German economist Klaus Schwab told an assembly of the World Economic Forum, which he founded, that the world was now entering a Fourth Industrial Revolution, one that “has the potential to raise global income levels and improve the quality of life for […]
Embedded module for high-end applications in extreme environmental conditions
The new COM Express TQMxE39C1 compact module from the embedded specialist TQ is available with the latest generation of Intel Atom processors (code name ‘Apollo Lake’), and it offers attractive technical properties optimized for harsh and rugged applications. The combination of the soldered 4/8GB Dual Channel DDR3L storage, ECC, an extended temperature range specification, optimized […]
element14 community launches ‘IoT on Wheels’ Design Challenge with STMicroelectronics
element14.com, has launched a new Design Challenge for designers and engineers called ‘IoT on Wheels’. Sponsored by STMicroelectronics, element14 is looking for 10 community members to demonstrate the power of IoT-connected transport solutions by creating a prototype that shows how current technologies can make today’s vehicles safer, smarter and more efficient. When we think about […]
USB 3.1 PHY designs optimized for low power consumption
Faraday Technology Corporation today announced that the availability of its USB 3.1 PHY on UMC 28HPC process, as well as the silicon-verified USB 3.1 Type-C PHY with USB-PD 2.0 support on UMC 40LP process. Faraday introduced the industry’s first USB 3.0 PHY IP solution in 2009; today’s launched USB 3.1 Gen 1 solutions are then designed with optimized PPA […]
Low-capacitance ESD diodes target high-speed interfaces in mobile devices
Toshiba America Electronic Components, Inc. (TAEC)* today announced that it has introduced a new lineup of multi-bit, low-capacitance electrostatic discharge (ESD) protection diodes for high-speed interfaces. Suitable for use in mobile devices, including smart phones, tablets, and wearable devices, the new diodes deliver excellent protection performance and support interfaces including USB 3.0/3.1 and HDMI. The new […]
BLE chips include ultra-frugal standby mode, high RF signal strength
The new-generation Bluetooth® Low Energy (BLE) System-on-Chip from , a global semiconductor leader serving customers across the spectrum of electronics applications, is set to accelerate the spread of connected smart objects throughout homes, shopping areas, industry, toys and gaming, personal healthcare and infrastructure. Built into all new mobile phones, tablets, and computers, Bluetooth Low Energy […]
Narrow-band IoT module keys on LPWA networking
MediaTek Inc. today unveiled its first narrow band Internet of Things (NB-IoT) System-on-Chip (SoC), the MT2625, and announced a collaboration with China Mobile to build the world’s smallest NB-IoT module (16mm X 18mm) around the chipset. MediaTek’s new ultra-low-power MT2625 SoC supports a full frequency band (from 450MHz to 2.1GHz) of 3GPP R13 (NB1) and […]