Components

TE Connectivity (TE), a world leader in connectivity and sensors, has introduced SOLARLOK 2.0 connectors. The new products enable photovoltaic system installers to make reliable connections more easy, quickly and cost-effectively. SOLARLOK 2.0 is a field-installable product that uses Insulation Displacement Contact (IDC) technology to create a connection between panels and cables without the need for […]

Ironwood Electronics recently introduced a new BGA socketaddressing high performance requirements – CBT-BGA-6087. The contactor is a stamped spring pin with 19 gram actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.93 nH, insertion loss < 1 dB at 14.1 GHz and contact resistance is <30mOhms. The current capacity […]

Electrical enclosures serve to protect electrical devices from adverse environmental influences, such as dirt, other particulates, moisture, or chemicals that could damage components. Plus, by housing electrical devices inside a secure enclosure or box, personnel are protected from electrical hazards such as electric shock, arc flash, and burns. However, electrical devices generate heat as a […]

Q-Tech Corporation, the world’s leading supplier of crystal oscillators for space, military, avionics and high-temperature applications, introduces the QT780 Series of space qualified crystal oscillators, designed for use as primary clocks in low earth orbit, small communications and broadcasting satellites. The QT780 series is offered with a broad range of operating frequencies (230 kHz – 162.5 MHz) […]

A nanocomposite invented at Rice University’s Brown School of Engineering promises to be a superior high-temperature dielectric material for flexible electronics, energy storage and electric devices. The nanocomposite combines one-dimensional polymer nanofibers and two-dimensional boron nitride nanosheets. The nanofibers reinforce the self-assembling material while the “white graphene” nanosheets provide a thermally conductive network that allows […]

As the number of electronics devices increases around the world, finding effective methods of recycling electronic waste (e-waste) is a growing concern. About 50 million tons of e-waste is generated each year and only 20% of that is recycled. Most of the remaining 80% ends up in a landfill where it can become an environmental […]

Inspired by the behaviour of natural skin, researchers at the Laboratory of Organic Electronics, Linkoping University, have developed a sensor that will be suitable for use with electronic skin. It can measure changes in body temperature, and react to both sunlight and warm touch. Robotics, prostheses that react to touch, and health monitoring are three […]

UnitedSiC has added seven new TO220-3L and D2PAK-3L device/package combinations to its UJ3C (general purpose) and UF3C (hard switched) series of 650V SiC FETs. These new devices provide new levels of high-voltage power performance in the fast growing data center server, 5G base station, and electric vehicle markets, where they will be used in power […]

Virtium’s TuffDrive M.2 USB line of SSDs bring high-endurance, low-power, small-form-factor solid-state storage to industrial-embedded applications. The SSDs enable designers to take advantage of USB 3.1’s widespread host support and efficiently connect M.2 form factor drives to host systems lacking the SATA storage interface. The drives provide cost-effective, secure storage to a wide range of […]

The Virtium TuffDrive M.2 USB SSDs feature the M.2 form factor and USB 3.1, enabling efficient, secure data storage in systems without the SATA interface.  The drives bring high-endurance, low-power, small-form-factor solid-state storage to industrial-embedded applications. The drives enable designers to take advantage of USB 3.1’s widespread host support and efficiently connect M.2 form factor drives to […]