Allegro MicroSystems, Inc. announced the launch of two new current sensor ICs – the ACS37030MY and the ACS37220MZ. Leveraging Allegro’s cutting-edge sensing technology, these ICs provide low internal conductor resistance, high operating bandwidth, and reliable performance across a wide range of automotive, industrial, and consumer applications. Allegro’s new current sensor ICs are designed for precise […]
CES 2025
Power controller handles high-current AI systems to OpenVReg16 specifications
Alpha and Omega Semiconductor Limited unveiled its AOZ73016QI, a 16-phase, 2-rail controller specifically designed to the latest OpenVReg16 (OVR16) specifications from NVIDIA. The AOZ73016QI controller design is based on the company’s high-performance, proprietary AOS Advanced Transient Modulator (A2TM) control scheme. In addition to supporting all the basic requirements of the OVR16 specification, the new AOS controller […]
Edge GenAI SoC supports 12 simultaneous 1080p30 video streams
Ambarella, Inc. announced during CES the N1-655 edge GenAI system-on-chip (SoC), which provides on-chip decode of 12x simultaneous 1080p30 video streams, while concurrently processing that video and running a hybrid of multiple, multimodal vision-language models (VLMs) and traditional CNNs. This SoC’s high AI processing performance supports most of the popular multimodal VLMs and large-language models […]
TDK’s ultrasonic time-of-flight sensor enhances sensing range and accuracy for smart home applications
TDK Corporation is presenting in its CES 2025 Booth #15815 how TDK MEMS sensors and solutions enable innovation in accessibility technology, as multi-award-winning company WeWALK announces the global availability of its Smart Cane 2 for visually impaired people. The WeWALK Smart Cane 2 is an intelligent assistive device empowered by TDK motion sensors, MEMS microphones, […]
Mid-range power factor chokes deliver 260-4500 uH inductance range
leITG Electronics has further expanded its range of mid-tier power factor correction chokes (PFCs) providing premium performance at a cost-effective price point. Suitable for applications with continuous conduction requirements in the 100-1,000 Watt range, the company’s PFC222222D Series is designed to meet rigorous AC to DC converter needs for the industrial, equipment, and automotive industries. […]
Cloud-based dev environment eliminates need for ECU simulation hardware
Intel has expanded its automotive product portfolio with integrated solutions for electric and software-defined vehicles (SDVs). The platform comprises high-performance compute units, discrete graphics, AI processing capabilities, power management systems, and zonal controller solutions, supported by the Intel® Automotive Virtual Development Environment (VDE) developed in conjunction with AWS. The Adaptive Control Unit (ACU) U310 features […]
Arm MCU pairs with DSP core for vehicle audio and sensing
At CES today, Texas Instruments released new automotive chips focused on in-cabin sensing and audio processing. The AWRL6844 60GHz millimeter-wave radar sensor integrates four transmitters and four receivers on a single chip, processing data through onboard AI algorithms. Through micro-movement analysis, the sensor achieves 98% accuracy for occupant detection and over 90% accuracy for child […]
12 nm silicon IP integrates multi-standard connectivity
Ceva, Inc. unveiled the Ceva-Waves Links200, the first turnkey multi-protocol platform IP to support next-generation Bluetooth High Data Throughput (HDT) technology, alongside IEEE 802.15.4 for Zigbee, Thread, and Matter. Integrating a new Ceva-developed radio designed for TSMC’s low-power 12nm process, the comprehensive Links200 solution provides a significant time-to-market advantage by removing technology barriers and risk…