From chipsets to network equipment to full-scale networks, benchmarking of communications products sets the bar for performance.
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What is the role of sensor fusion in robotics?
As robots become increasingly autonomous, sensor fusion is growing in importance. Sensor fusion merges data from multiple sensors on and off the robot to reduce uncertainty as a robot navigates or performs specific tasks. It brings multiple benefits to autonomous robots: increased accuracy, reliability, and fault tolerance of sensor inputs; extended spatial and temporal coverage […]
Sensor fusion levels and architectures
Sensor fusion is the process of combining inputs from two or more sensors to produce a more complete, accurate, and dependable picture of the environment, especially in dynamic settings. The goal of sensor fusion is to provide those improved results with the minimum number of sensors and minimum system complexity for the lowest cost. The […]
When to measure conductivity instead of resistivity
Resistivity and its inverse, conductivity, are different from the more familiar metrics, resistance and its inverse, conductance. Resistivity is applicable to types of materials. For example, glass and carbon have specific resistivities whereas a particular carbon resistor of a given length, diameter and temperature has a specific resistance. In a nutshell, resistance is defined as […]
Sensor fusion – How does that work?
Each sensor type, or modality, has inherent strengths and weaknesses. Sensor fusion is the process of bringing together inputs from multiple sensors to form a single model or image of the environment around a platform. The resulting model is more accurate because it balances the strengths of the various sensors. Sensor fusion brings the data […]
How Open RAN provides a secure wireless network
Keeping Open RAN software secure means containerizing functions, securing each container, and securing the entire software design.
Advanced power electronics packaging
The trends in advanced power electronics packaging mirror the overall packaging trends in the electronics industry. Those trends include adopting chip-scale packaging (CSP), 3D packaging, 3D printing (also called additive manufacturing), and advanced thermal management materials. In power electronics, these trends are being heavily influenced by the adoption of gallium-nitride (GaN) and silicon-carbide (SiC) wide […]
Squash 1/f noise with zero-drift amplifiers
There is a device that squashes all the 1/f voltage and current noise calculations with a chopper amplifier algorithm that corrects offset and drift characteristics. These amplifiers are zero-drift, auto-zero, or choppers that all achieve nanovolt-level offsets and extremely low offset drifts due to time and temperature. But back to our noise discussion, these devices […]
Interview: Lower fiber losses mean fewer errors
Corning’s Roshene McCool explains how the SMF-28 Contour fiber reduces light losses, installation costs, and operating costs in fiber connections for 5G, computing, and datacenters.
What are the applications of 3D and 4D printed electronics?
3D printing is the fabrication of a three-dimensional object under computer control, with one or more materials being added layer by layer. 3D printing, or additive manufacturing, is used across various electronics applications, including circuit boards, energy storage devices, actuators, and sensors. It can be implemented using a variety of technologies, including selective laser sintering […]