Richardson Electronics, Ltd. (NASDAQ: RELL) announced today a new distribution agreement with DAPU Telecom, a leader in frequency control and timing solution products. The agreement aligns with both companies’ commitment to providing the highest reliability and quality products into various applications including RF and microwave communications, industrial, wired and wireless transmission, radar and test equipment. […]
Industry News
Heilind Electronics and Laird Performance Materials sign global distribution agreement
Heinlind Electronics announced today the signing of a global distribution agreement with Laird Performance Materials, a portfolio company of privately held Advent International. Laird serves leading names in electronics with innovative thermal interface materials; electromagnetic interference shielding materials and magnetic ceramic solutions; RF and microwave absorbers; precision and structural metals; and industry-leading multifunctional products. The […]
Advanced material delivers high-temperature performance in electronics applications
Greene Tweed, a global manufacturer of high-performance seals, thermoplastics, composites, and engineered components, highlights its innovative Arlon 3000 XT thermoplastic for electronics applications in this brief, informative video. Arlon 3000 XT provides excellent thermal stability and chemical resistance, very low moisture absorption, remarkably low wear, and high impact resistance. Arlon 3000 XT, the world’s first […]
ECIA survey on impact of COVID-19 on electronics industry shows shift toward “no” or “minimal”
With the spread of the Coronavirus COVID-19 there is a need to provide visibility on how this crisis is impacting the electronic components industry and the supply chain. In order to provide this important visibility, ECIA has been conducting surveys of member manufacturing and distributor companies to gain an understanding of this fluid situation. ECIA […]
Siemens and Qualcomm establish private, standalone 5G network in industrial environment
Siemens and Qualcomm Technologies, Inc. have implemented the first private 5G standalone (SA) network in a real industrial environment using the 3.7-3.8GHz band. Both companies have joined forces in this project: Siemens is providing the actual industrial test conditions and end devices such as Simatic control systems and IO devices and Qualcomm is supplying the…
“Engineering Big Ideas” video series: Prototyping tangible products with crowd funding
Mouser Electronics Inc. and celebrity engineer Grant Imahara unveiled the third video in the Engineering Big Ideas series, part of their award-winning Empowering Innovation Together™ program. In part three, Imahara meets with Josh Lifton, President of Crowd Supply, a successful crowd funding platform based in Portland, Ore. Crowd Supply partners with creators and entrepreneurs who […]
2019 LEAP Award winners announced
CLEVELAND, November 5, 2019 — Winners in the second annual LEAP Awards, celebrating the best components and services across the mechanical and electrical engineering design space, were unveiled today. Across 13 categories, the judging panel awarded Gold, Silver and Bronze recognitions, as well as Honorable Mentions for certain submissions. The awards program is supported by three […]
Farnell rebrands its private label collection as Multicomp Pro
Farnell, the Development Distributor, has launched a new collection of affordable components, tools and test equipment under its new brand, Multicomp Pro. This collection brings the very best products from Multicomp, Duratool, Tenma, Pro-Power, Pro-Elec and Pro-Signal under one brand, making it easier for design engineers, technicians and production facilities to identify high-value alternatives, whilst […]
Prototype design with Arduino in latest “Engineering Big Ideas” series video
Mouser Electronics Inc. and celebrity engineer Grant Imahara today released the second video in the Engineering Big Ideas series, part of Mouser’s award-winning Empowering Innovation Together program. Watch the latest video at https://mou.sr/EIT2019-2. In the second video of the Engineering Big Ideas series, Mouser and Imahara take viewers along to Milan, Italy, for a visit to […]
LEAP Awards deadline extended to September 16th
Due to multiple requests for an extension (as well as the Labor Day holiday in the U.S.), the deadline for submissions into the 2019 LEAP Awards has been extended to Monday, September 16th. Entries submitted must be new products that are commercially available in the United States and have been released since January 1, 2018 and […]
