element14.com has launched a giveaway for educators to help get the popular micro:bit coding device into the hands of more students and get teachers talking about how to use it in the classroom. For many students and educators, the month of August signifies the approaching return to school, and shopping for the classroom. The element14 […]
Sager Electronics enhances thermal offering with Henkel’s Bergquist brand
Sager Electronics announces the addition of BERGQUIST to its thermal management solution set. BERGQUIST is a world leading brand within Henkel’s broad portfolio of thermal material solutions. Bill Nulf, Director of Channel Sales Americas for Henkel Corporation, commented, “In Sager Electronics we saw a unique opportunity to work with a distributor with a technical sales force focused […]
Free lit: The Hitchhiker’s Guide to PCB Design
EMA Design Automation announced the launching of its new and free eBook titled,The Hitchhiker’s Guide to PCB Design, a timely and much-needed resource for electrical engineers seeking to understand the complexities involved in PCB design. “The role of the electrical engineer in PCB design is changing,” said Manny Marcano, president and CEO of EMA. “EE’s are […]
New crystal structure triples output power of GaN transistors, expands radar observation range
Fujitsu and Fujitsu Laboratories have succeeded in developing a transistor that can provide both high current and high voltage in gallium-nitride (GaN) high electron mobility transistors (HEMT), effectively tripling the output power of transistors used for transmitters in the microwave band. Fujitsu’s crystal structure improves operating voltage by dispersing the applied voltage to the transistor, and […]
Qorvo first to be certified for Zigbee Green Power v1.1 multi-sensor and generic switch extension
Qorvo announced it has been awarded certification for the multi-sensor and generic switch features of Zigbee Green Power v1.1. These new features greatly expand the types of smart home sensors that can be powered by energy harvesting, eliminating the need for batteries or enabling ultra-long battery life. The multi-sensor extension to the Green Power specification significantly […]
Central Semiconductor redesigned website simplifies part selection
Central Semiconductor Corp., today launched a new solutions-focused version of its website. The extensive rebuild of the front end and back end infrastructure is designed to enable designers to effortlessly explore the many possibilities of Central’s custom discrete solutions. The responsive nature of the new site allows users to easily view it on any device, from […]
MIPI A-PHY spec underway for ADS, ADAS and surround sensor applications
The MIPI Alliance has mapped a course to address the automotive industry’s needs for high-speed data interface specifications. With development of the MIPI A-PHY physical layer specification already underway to meet 12-24 gigabits per second (Gbps), requirements gathering has begun to support higher speeds including over 48 Gbps for display and other use cases. When complete, […]
Debug probes support RISC-V, Arm and other CPU platforms
UltraSoC announced that it has partnered with SEGGER to offer support for J-Link debug probes within UltraSoC’s integrated system on chip (SoC) monitoring and analytics environment. SEGGER’s J-Link probes are amongst the industry’s most widely-used and support the debug of popular processor platforms including RISC-V, and both current and legacy Arm cores. The partnership gives SoC developers […]
ADI and B-Secur collaborate on biometric authentication technologies for automotive industry
Analog Devices, Inc. (ADI) announced today a collaboration with B-Secur LTD to develop a complete biometric authentication solution for use in automotive vehicles. The combination of ADI’s leading signal conditioning technology with B-Secur’s electrocardiogram (ECG) biometric algorithms software will enable automobiles to uniquely authenticate and identify drivers and passengers. The technology is designed to detect driver […]
Intel and SiTime collaborate to build 5G platforms with MEMS-based silicon timing devices
SiTime Corporation and Intel today announced a collaboration to work together on integrating timing solutions for Intel’s 5G multi-mode radio modems, with additional applicability to Intel LTE, millimeter-wave wireless, Wi-Fi, Bluetooth, and GNSS solutions. SiTime’s MEMS timing solutions enhance system performance in the presence of stressors such as vibration, high temperature, and rapid thermal transients. Such […]
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