Valens announced the VA7000 family of automotive chipsets, which will deliver ultra-high-speed connectivity with the most resilient physical layer (PHY) for error-free links and high EMI immunity. The VA7000 chipsets will be the first in the industry to implement the MIPI A-PHY standard for advanced driver-assistance systems (ADAS) and autonomous driving systems (ADS). MIPI A-PHY, now in its […]
Microcontroller Tips
Reference design calculates proximity to nearby Bluetooth non-connecting beacons
STMicroelectronics announces the availability of a compact and cost-effective reference design ideally suited for monitoring social distancing, assuring remote operation, provisioning, as well as warning, anti-tampering, and potentially providing contact tracing to protect human health in all environments, including in response to global or local pandemic conditions. Leveraging Bluetooth Low Energy technology through its incorporation […]
Software supports RISC-V P extension for Packed-SIMD Instructions
IAR Systems announces initial support for the draft RISC-V P extension in its powerful development tools IAR Embedded Workbench for RISC-V. Thanks to this early support for the extension as implemented by Andes Technology, a Premier Founding member of RISC-V International, developers are able to take advantage of a leading development toolchain when starting to […]
Modules sense environmental inputs for IIoT systems
TT Electronics announced the launch of ‘Speed to Connect’, an innovative framework that enables customers to deploy smart IoT solutions faster and more cost-effective than going it alone. Speed to Connect is an end-to-end IoT framework that seamlessly delivers hardware, connectivity, infrastructure, and user experience solutions. By streamlining the secure connection of products and systems, users achieve tangible results such as improving efficiencies, eliminating unnecessary maintenance, […]
USB4 IP covers controllers, routers, PHYs
Synopsys today introduced the industry’s first complete DesignWare USB4 IP solution consisting of controllers, routers, PHYs, and verification IP. The DesignWare USB4 IP operates at up to 40 Gbps, which is twice the maximum data rate of USB 3.2 and is backward compatible with USB 3.x and USB 2.0 systems. The DesignWare USB4 IP supports […]
Software speeds low-power FPGA apps
Lattice Propel is a new software solution designed to accelerate development of unique applications based on low-power, small form factor Lattice FPGAs. The design environment will enable the easy assembly of components from a robust IP library, including a RISC-V processor core and numerous peripherals, to empower developers of any skill level to quickly and […]
Multi-function, mesh-sensor unit simplify IoT position tracking and sensor data collection
Fujitsu Component America, Inc. has released a series of battery-powered Wirepas Mesh technology mesh units and mesh-sensor units. The devices simplify construction of large-scale decentralized networks to allow scalable, reliable and cost-effective IoT solutions for position tracking and sensor data collection. In addition to deploying large-scale networks, the mesh units (FWM8BLZ07P) and mesh-sensor units (FWM8BLZ07Y) […]
Collaboration focuses on development tools for RISC-V-based MCUs
IAR Systems and GigaDevice Semiconductor Inc. announce that they have formed a partnership in order to deliver powerful development tools for GigaDevice’s RISC-V based microcontrollers (MCUs). IAR Systems provides the C/C++ compiler and debugger toolchain IAR Embedded Workbench. The toolchain offers leading code performance for size and speed, as well as extensive debugging functionality with […]
NFC ICs highlight security, integrated functions
NXP Semiconductors N.V. announced its new MIFARE DESFire EV3 IC that ushers in next-generation performance, advanced security, and seamless integration of mobile services for a new era of security and connectivity in smart city services. As the third evolution of NXP’s proven contactless MIFARE DESFire portfolio, the latest IC is backwards compatible and offers enhanced […]
Automotive wafer-level camera modules, 140dB HDR image sensors highlight flicker mitigation
OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OVM9284 CameraCubeChip module—the world’s first automotive-grade, wafer-level camera. This 1 megapixel (MP) module has a compact size of 6.5 x 6.5mm to provide driver monitoring system (DMS) designers with maximum flexibility on placement within the cabin while remaining hidden from view. […]