Designed and manufactured to satisfy performance-focused next-generation gaming, industrial, and sports applications, the STMicroelectronics LSM6DSR MEMS inertial module combines high stability with advanced digital features, low power consumption, and small size for head-mounted displays, wearable trackers, smartphones, robotics, and drones. The LSM6DSR MEMS System-in-Package contains a 3-axis digital accelerometer and a 3-axis digital gyroscope with […]
Microcontroller Tips
Dev kit includes 3U SGC, RF processing for electronic warfare projects
Abaco Systems today announced the VP430 Development Kit, which is designed to enable application developers to make a fast start on the creation, debugging and optimization of advanced electronic warfare applications. The VP430 Development Kit includes a VPX370 development platform, pre-integrated with a 3U VPX SBC329 single board computer, and the VP430 Direct RF Processing System. The […]
ICs implement single-port USB under vehicular radios, in center consoles, or alongside wireless chargers
As demand for in-vehicle entertainment and smartphone applications continues to grow, automotive manufacturers must provide dependable and convenient connectivity in designs — all while optimizing system costs. Extending its portfolio of leading USB automotive products, Microchip Technology Inc. introduced new single-port products to its USB 2.0 Smart Hub IC family, giving automakers more options to fit varying […]
5G-ready jitter attenuators make high-speed network timing more accurate
Silicon Labs has expanded its family of Si539x jitter attenuators with new device options featuring a fully integrated reference, enhancing system reliability and performance while simplifying PCB layout in high-speed networking designs. The new Si539x jitter attenuators are purpose-built to address the demanding reference clock requirements of 100/200/400/600/800G designs, providing more than 40 percent margin […]
Data acquisition module offers max sampling rate of up to 200 kS/s
ICP DAS USA’s new PET-7H16M is a high-speed data acquisition module with a built-in Ethernet communication port for network data transfer. It includes eight high-speed analog input channels with a FIFO of 2048 samples and a maximum sampling rate of up to 200 kS/s, with 16-bit analog to digital (A/D) converters simultaneously sampling on each […]
Open-source, 9-DOF inertial measurement unit carries CAN, RS232 interfaces for 12 and 24-V vehicle systems
ACIENNA announced its new OpenIMU300RI. a rugged, sealed-package, open-source, nine-degree-of-freedom (9-DOF) inertial measurement unit (IMU) for autonomous off road, construction, agricultural and automotive vehicle applications. This new open-source IMU, allows engineers to easily optimize an attitude, navigation or other algorithm for their vehicle/application and run it in on the IMU. This minimizes communication on the bus […]
Miniature high-temp oscillators target down-hole applications
Q-Tech Corporation announces the availability of the QTCH Series of ultra-miniature crystal oscillators for high-temperature, applications. With a wide operating temperature range of -55C to 200C and offered in small, low-profile, surface-mount package sizes, the QTCH series is ideal for down-hole drilling as well as a host of other high-temperature, high shock/vibration applications. The QTCH series […]
ROM-based GNSS module targets mass-market tracking, nav apps
STMicroelectronics has enlarged its GNSS product offering with the Teseo-LIV3R ROM-based module. The competitively-priced module provides ST’s full GNSS algorithm capability for cost-conscious tracking and navigation devices. ST’s new GNSS module provides odometer functionality with three trip counters and reached-distance alert, along with geofencing capabilities with up to eight configurable circles and crossing-circles alarm. Support for real-time […]
48-MP image sensor features 0.8-micron pixel size for high-rez smartphone cameras
OmniVision Technologies, Inc. announced the OV48B, its first 48 megapixel (MP) image sensor featuring a 0.8-micron pixel size to enable high-resolution smartphone cameras in a 1/2″ optical format. Built on OmniVision’s PureCel® Plus stacked die technology, this sensor provides leading edge still image capture and video performance for both mainstream and high-end smartphones. Additionally, the […]
UWB technology features mix of 2D and 3D precise positioning with low power consumption
NXP Semiconductors N.V. announced at its annual developer conference in the Silicon Valley its development of UWB technology designed for a broad range of markets, including mobile, automotive, Internet-of-Things (IoT) and industrial. NXP’s new UWB technology brings secure ranging and precision sensing creating a new dimension of spatial context for wireless devices. This strategic announcement […]