Electrical Engineering News and Products
Electronics Engineering Resources, Articles, Forums, Tear Down Videos and Technical Electronics How-To's
Microsemi Corporation, a provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of its Secured Production Programming Solution (SPPS) for its field…
The post FPGAs get cryptographic keys to prevent cloning appeared first on Microcontroller Tips.
Cypress Semiconductor Corp. (NASDAQ: CY) has introduced a Bluetooth Low Energy module solution that extends the range of Bluetooth to 400 meters, eight times that of current Bluetooth…
The post Bluetooth LE module transmits to 400 m appeared first on Microcontroller Tips.
Microchip Technology Inc. has announced four compact, low-power, highly integrated solutions that allow Wi-Fi and networking capability to be embedded into virtually any device, including Internet of Things…
The post Low-power Wi-Fi modules target IoT apps appeared first on Microcontroller Tips.
Cadence Design Systems, Inc. has announced that it is updating its leading-edge, high-speed SerDes communication interfaces and low-latency Denali DDR memory IP solutions to support TSMC’s 16nm FinFET Compact…
The post DDR design IP will handle 16-nm FinFET chips appeared first on Microcontroller Tips.
Cassia Networks has unveiled its official SDK that will give developers and vendors the ability to create new applications utilizing the extended range for Bluetooth devices that its…
The post SDK for extended-range Bluetooth router appeared first on Microcontroller Tips.
Linear Technology Corporation introduces the LTC2873, an RS485/RS232 multiprotocol transceiver in a small 20mm² package. The LTC2873 integrates all the functions necessary to provide the most compact multiprotocol…
The post Multiprotocol transceiver reduces component count in RS485/RS232 systems appeared first on Microcontroller Tips.
Cadence Design Systems, Inc. has announced the availability of the industry’s only foundry-proven IC packaging design and analysis solutions for advanced Fan-Out Wafer-Level Chip Scale Packaging (WLCSP) and…
The post WLCSP design package targets power-optimized wireless mobile devices appeared first on Microcontroller Tips.
Xilinx, Inc.has announced the delivery of the industry’s most flexible and comprehensive Ethernet portfolio for data center interconnect, service provider, and enterprise applications. Xilinx’s comprehensive IP portfolio includes…
The post 100G Ethernet MAC chip integrates RS-FEC to save power appeared first on Microcontroller Tips.
Avnet, Inc. has today introduced the new MicroZed Industry 4.0 Ethernet Kit (I4EK), enabling multi-protocol Industrial Ethernet solutions based on the Xilinx Zynq-7000 All Programmable SoC and Anybus…
The post Industry 4.0 ethernet kit puts network designs on FPGAs appeared first on Microcontroller Tips.
by Brig Asay, Keysight Technologies USB-C cords promise to be all-in-one cables for the next decade thanks, in no small part, to the way this new spec handles…
The post Power delivery and the Type-C revolution appeared first on Microcontroller Tips.
