Synopsys announced that the DesignWare STAR Memory System solution offers new memory built-in self-test (BIST), repair, and diagnostic capabilities for embedded MRAM (eMRAM)-based designs, with initial support for GLOBALFOUNDRIES (GF) eMRAM on the 22FDX process. The STAR Memory System’s new algorithms target failure mechanisms of embedded MRAM and other types of non-volatile memories during production and in-field test. […]
Microcontroller Tips
New 16-MP image sensor brings hi-res to mainstream smartphones
OmniVision Technologies, Inc. announced the OV16E10 — the latest generation of its high-performance 16-megapixel (MP) image sensor family. Built on OmniVision’s latest 1.12-micron PureCel Plus stacked die technology with world-class sensitivity and QE performance, the 1/2.8” OV16E10 sensor comes with advanced imaging features to deliver industry-leading performance for both single- and multi-camera applications. Integrated into this sensor is a 2×1 Microlens phase-detection […]
SBC in Pico-ITX form factor support diverse packaging solutions
WinSystems today announced its Intel E-3800 processor-based computing platform in the Pico-ITX form factor. Measuring a mere 3.9 inches by 2.8 inches (100 mm by 72 mm), the ITX-P-3800 delivers low-power performance, endurance and versatility. The proven design of this rugged single board computer (SBC) accelerates time to market for new products while assuring that they will perform […]
Second-gen AI accelerator offers 10x reduction in energy consumption
Gyrfalcon Technology Inc. (GTI) announced the availability of its second-generation chip, the Lightspeeur 2803 AI Accelerator. The chip is designed to be used in multiple chip board solutions, initially on the G.A.I.N. Series 2803, and meets the demanding requirements of data centers supporting inference server AI operations. The rapid adoption of AI is quickly requiring […]
First single-chip 1080-p LCOS microdisplay carries integrated driver for AR/VR and projector designs
OmniVision Technologies, Inc. announced the OP02220 — the industry’s first 1080p liquid crystal on silicon (LCOS) microdisplay with integrated driver functions and memory. This compact, low-power and cost-effective microdisplay is especially valuable for augmented reality (AR) applications such as glasses and head-mounted displays that need durability, compactness and lightweight. This is a burgeoning market as consumer demand […]
IC design software includes DFT circuit modifications to reduce silicon test costs
Synopsys announced the availability of Test Fusion technology with new test point functionality, providing design teams with powerful design-for-test (DFT) circuit modifications to reduce silicon test costs by an average of forty percent and increase defect detection while meeting design targets for power, performance, and area. Test Fusion ensures the test points avoid introducing routing […]
IC design software includes automotive-grade automatic test pattern generation technology
Mentor, a Siemens business, today announced the availability of automotive-grade automatic test pattern generation (ATPG) technology for its Tessent TestKompress software. The new technology includes a suite of fault models and test pattern generation applications that target defects in ICs at the transistor and interconnect levels – in the process helping customers capture defects that […]
80-MHz Arm Cortex-M4 MCUs include 64Kbyte/128Kbyte Flash, energy management
With a focused feature set and compact package options, STMicroelectronics’ STM32L412 and STM32L422 microcontrollers (MCUs) bring ultra-low power technologies and high performance to budget-conscious consumer, industrial, and medical applications. Whether the squeeze is on core performance, energy, physical space, or bill of materials, the new MCUs give more freedom to beat the constraints. Combining economical 64Kbyte or […]
Vision development kit accelerates ADAS/autonomous system design-through-production
D3 Engineering, a Texas Instruments platinum design partner, announced its DesignCore RVP-TDA2Px Development Kit for autonomous systems development. The production-intent kit features TI’s TDA2Px SoC processor and 4Gbps FPD-Link III SerDes interface. D3 Engineering’s Rugged Vision Platform (RVP) allows rapid technology evaluation and system development under realistic on-vehicle conditions. It accelerates development of Advanced Driver Assistance […]
50 Mp CCD image sensor targets inspection of smartphone displays
ON Semiconductor is enabling more efficient inspection of smartphone displays with the introduction of a new 50 megapixel (MP) resolution charge-coupled device (CCD) image sensor. As the highest resolution Transfer CCD image sensor commercially available, the KAI-50140 provides the critical imaging detail and high image uniformity needed not only for inspection of smartphone displays but also […]