With the SHDSL standard, data can be transmitted over extremely long copper cables. This makes this technology the first choice in applications where Power over Ethernet and DSL technologies like G.FAST, VDSL are not possible. With its SHDSL Evaluation Kit, Würth Elektronik now offers developers the possibility to test applications with the SHDSL transceiver from Intel. […]
Microcontroller Tips
SoC development platform handles MCVP automotive work
Renesas Electronics Corporation announced its collaboration with Microsoft to accelerate the development of connected vehicles. Renesas’ R-Car Starter Kit, based on Renesas’ R-Car automotive system-on-chip (SoC), is now available as a development environment for the Microsoft Connected Vehicle Platform (MCVP)<https://www.microsoft.com/industry/automotive/connected-vehicles>. MCVP combines a partner ecosystem with a horizontal platform of Azure cloud, AI, and edge […]
Free firmware upgrade brings MQTT IIoT support to PLC CPUs
IDEC Corporation has released a free firmware upgrade enabling new and existing MicroSmart FC6A Plus PLC CPUs to support the industry-standard MQTT protocol. The upgrade can be downloaded to the FC6A CPU, so it is easy for users to connect all types of field data to on-site and cloud-based brokers, and make the information readily […]
High-rez automotive viewing camera ICs add cybersecurity features
OmniVision Technologies, Inc. announced during CES the OX03F10 automotive image sensor. This sensor expands OmniVision’s next-generation ASIL-C viewing camera family with higher 3MP resolution and cybersecurity features that are required as vehicle designers make the transition from Level 2 and 3 advanced driver assistance systems (ADAS) to higher levels of autonomy. The OX03F10 also maintains the family’s unique […]
MEMS motion sensor/software combo targets smart TV, robotics, AR/VR, wearables, IoT apps
TDK Corporation announces the availability of the InvenSense ICM-40627 and ICM-42688-V high-performance MEMS motion tracking solutions (6-axis IMU + dedicated software library). As a leader in consumer IoT, TDK continues to provide a complete suite of SmartMotion sensor solutions for a broad range of consumer and IoT applications. In addition, a comprehensive development platform, the […]
Low-power MEMS barometric pressure sensor targets drone, IoT apps
TDK Corporation announces the InvenSense ICP-20100 platform, the latest technology advancement in the SmartPressure product family. The ICP-20100 is a barometric pressure sensor based on MEMS capacitive technology, improving our lead in the development of ultra-low noise at the lowest power and progressing our industry-leading relative accuracy, sensor throughput, and temperature stability. The ICP-20100 achieves […]
Low-power microphones include wake-on-sound feature
TDK Corporation introduces the InvenSense T5838, the latest technological breakthrough in the SmartSound product family. The T5838 is the world’s lowest power Pulse Density Modulation (PDM), multi-mode MEMS microphone with high AOP and high SNR for smartphones, microphone arrays, smart speakers, IoT, and other consumer devices. The microphone offers an exceptionally efficient 130 µA ultra-low […]
Reference design provides lane-level positioning accuracy via radar
TDK Corporation announces the partnership of Trusted Positioning Inc. (TPI), a TDK Group Company, and Uhnder. TPI and Uhnder have partnered to develop a localization reference design with world-class accuracy and performance with Uhnder’s software-defined digital radar sensor and TPI’s AUTO positioning software. The combined solution provides lane-level positioning accuracy in urban areas where GNSS […]
ASIL-rate IMU optimized for autonomous vehicle apps
TDK Corporation announces the availability of the InvenSense IAM-20685, the latest release in the SmartAutomotive product family. The IAM-20686 is a new ASIL-B monolithic 6-axis MEMS IMU developed in compliance with ISO 26262. Taking advantage of TDK’s proprietary MEMS fabrication platform and technology, the IAM-20685 features a highly integrated single-chip 6-axis MEMS gyroscope and accelerometer […]
Next-gen MEMS microphone sports 73 dB SNR, high acoustic overload point
Infineon is launching a next-generation analog MEMS microphone that renders even better results – the XENSIV MEMS microphone IM73A135. In microphones, designers often have to accept trade-offs: high signal-to-noise ratio (SNR), a small package, high acoustic overload point, low power consumption, MEMS versus electret condenser microphones (ECM). For this reason, applications that require the highest […]
