Real-Time Innovations (RTI) announced the availability of the Connext 6 ROS Middleware Wrapper (RMW) Layer, bringing the field-proven, production-grade strength of RTI Connext 6 to the latest release of the Robot Operating System (ROS 2). Robotics software developers can now leverage the ROS 2 ecosystem together with RTI Connext Tools to more rapidly develop, test, and debug […]
Microcontroller Tips
Latest LoRaWAN Regional Parameters includes support for all versions of the Layer 2 specification
The LoRa Alliance announced the release of Regional Parameters RP2-1.0.2, which includes support for all versions of the LoRaWAN Layer 2 Specification. Support of LoRaWAN operation in Senegal, Montserrat, Mali, Guinea, Syria, and Vanuatu has been identified, with the RP now supporting more than 200 countries and regions globally. One major change to the Regional Parameters is the addition […]
Bidirectional level translator connects SD 3.0 memory with low-voltage processing hardware
Diodes Incorporated announced the PI4ULS3V4857, an SD 3.0-compliant bidirectional level translator for use in communication, consumer, and computing system applications including smartphone handsets, notebooks, SD/MicroSD card readers, wireless access points, and 5G femtocells. The PI4ULS3V4857 has the capacity to translate a 1.2V to 1.8V host side voltage into a memory card voltage signal of either […]
Industrial-grade router features global LTE Category 4 connectivity in single SKU
Digi International launched the Digi IX10 industrial router. The newest addition to the Digi IX industrial cellular router family is purpose-built to provide cost-effective, rightsized connectivity in industrial infrastructure environments, including digital signage, critical asset monitoring, and unattended retail applications. The Digi IX10 offers a comprehensive feature set with advanced manageability, security, reliability, and network intelligence […]
Camera simultaneously monitors drivers, captures vehicle occupants for one-way videoconferencing
OmniVision Technologies, Inc. announced in advance of AutoSens Detroit the automotive industry’s first complete solution for dual-mode camera applications. This joint solution simultaneously monitors drivers while capturing vehicle occupants for one-way video conferencing. It features OmniVision’s automotive industry-first OV2312 image sensor, with a dual-mode global shutter that captures both RGB color images and IR images under low-light conditions. These […]
MCUs simplifies and accelerates automotive software development
NXP Semiconductors N.V. announced the S32K3 microcontroller (MCU) family, the newest addition to its S32K product line. The S32K1 family, released in 2017, marked an important turning point in addressing software’s central role in automotive development. The new S32K3 family, designed for automotive body electronics, battery management, and emerging zone controllers, continues to simplify software […]
Development kit enables rapid development for 1 kW to 10 kW applications
ON Semiconductor has introduced its advanced and flexible Motor Development Kit to accelerate the development of more efficient motor control solutions for applications ranging from less than 1 kW to over 10 kW. Electric motors account for over half of all the power generated and consumed by industrialized countries. The majority of those motors are […]
Reference platform simplifies development of direct Time-of-Flight,LiDAR-based systems
The application of light detection and ranging, or LiDAR, is growing across all sectors, including robotics and industrial proximity sensing where millimeter range accuracy is mandatory. It is typically based upon the dToF method, which measures the time it takes for a pulse of light, normally in the Near Infrared (NIR) wavelength range, to travel […]
176-layer NAND expands storage capability across data-intensive applications
Representing Micron’s fifth generation of 3D NAND and second-generation replacement-gate architecture, the world’s first 176-layer NAND flash memor features approximately 30 percent smaller die size than best-in-class competitive offerings. Micron’s 176-layer NAND’s compact design is well-suited for small-form-factor applications in spanning data center, intelligent edge, and mobile devices and serves as an essential building block […]
The Iridium global satcom system, Part 5: Advances and competition
This worldwide satellite-based communications system went from dream to reality in a decade but quickly failed in the market; its revival took persistence and luck, plus a new customer base. Of course, there were also significant technological advances required in many areas, including designing and building longer-life electronics despite the unavoidable effects of space radiation […]
