A new high-performance elastomer socket is designed to handle 0.35-mm-pitch WLCSP packages. The SG25-BGA-2071 socket is designed for a 4.525×4.525-mm package size and operates at bandwidths up to 52 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ/pin. Network analyzer reflection measurements for the G-S-S-G case […]
>The Infinitum 10/10XT writes directly on flexible PCB resist to produce circuit images while the Apeiron system uses laser to product via holes.
Rogers Corporation is pleased to introduce SpeedWave 300P Ultra-Low Loss Prepreg. With the increasing need for stackup flexibility in high layer count designs for 5G mmWave, high resolution 77 GHz automotive radar, aerospace & defense and high speed digital designs, SpeedWave 300P prepreg offers a broad range of competitively priced high performance options for the […]
With its WE-TGF (Thermal Gap Filler) Würth Elektronik now offers a new solution for heat dissipation. The outstanding feature of the self-adhesive gap-filler material: The non-conductive barrier with a high dielectric strength has a high thermoconductivity index of 1 W/(m*K). The material easily adapts to the differing thicknesses of components on the PCB and fills […]
Zuken announces the availability of eCADSTAR release 2020. With the new release, available configurations of Zuken’s new internet connected PCB design platform, eCADSTAR, have been extended to include new modules for signal integrity, power integrity and IBIS-AMI simulation. The new modules eCADSTAR Signal Integrity, eCADSTAR Signal Integrity Advanced, eCADSTAR Power Integrity and eCADSTAR IBIS-AMI complement […]
Digi-Key Electronics announced that it now offers a printed circuit board (PCB) builder tool to streamline customers’ ordering experience of PCBs and to more broadly support their rapid prototyping needs. The PCB Builder allows PCBs to be shipped directly from the PCB manufacturer and will allow customers to receive instant quotes from multiple PCB companies […]
The increasingly compact design in electronics development today means that power and signal connections are now combined on the same printed circuit boards. The resulting increase in power density changes how we think about the requirements for PCB connection technology. Download this white paper to learn more.
Altium has launched a new cloud-based application that redefines the way that printed circuit board designs are shared between designers, part suppliers, and manufacturers. The A365 Viewer, powered by the Altium 365 cloud platform, is a brand new, and innovative way to view and share electronic designs through a browser on any web-enabled desktop, phone […]
The 2019 Robotics Summit in Boston on June 5th and 6th is a premier robotics event focused on the design, development, manufacture, and delivery of commercial robotics. The Summit is co-located with the DeviceTalks event at the Seaport World Trade Center. Critical technical challenges remain when designing electronics for robotics systems particularly in the context of […]
Nexperia announced the four pin X2SON4 package which is the smallest logic package that can be used without requiring an expensive and fragile step-down mask. Nexperia developed the X2SON packages — part of its MicroPak package range — to provide the smallest footprint for logic functions while ensuring pad pitch remains 0.4mm or over (step-down masks are only […]