A new BGA socket design uses high-performance elastomer capable of 94 GHz, features low inductance and handles wide temperature applications. The GT-BGA-2164 socket is designed for a 23×23-mm package size and operates at bandwidths up to 94 GHz with less than 1 dB of insertion loss. The socket is designed with a screw-down lid and […]
PCB Design
Current and future PCB fabrication trends you need to know
by Ken Ghadia, Sales Engineer, TechnoTronix PCB fabrication is transforming circuit board design into a physical PCB based on design specifications. It is usually an outsourced activity done by a Contract Manufacturer (CM) who strictly follows the specifications provided by the designer. Certain critical factors like choice of the PCB substrate, layout strategy, surface coating requirements […]
Pin fin, slant fin heat sinks offer economical device cooling
Advanced Thermal Solutions, Inc. (ATS) is now providing Pin and Slant Fin heat sinks made from lightweight, extruded aluminum to provide low-cost cooling solutions for many hot PCB components. Pin Fin sinks have a high-efficiency design that harnesses cooling airflow from any direction. They reliably perform in spatially constrained PCB layouts where the airflow direction […]
Software helps predict PCB performance
Altair has launched a special edition of Altair PollEx, an electronic system design (ESD) software tool, for Altium users to empower printed circuit board (PCB) designers to predict and maximize overall PCB performance and verify manufacturability. ltair PollEx for Altium is a free version of PollEx designed to support various electrical computer-aided design (ECAD) software products, […]
Electronics design platform simplifies PCB assembly
Altium LLC and MacroFab, Inc. today announced that Altimade, the electronics industry’s first “design WITH manufacturing” application, is now available to the Altium user community. Available on the Altium 365 cloud platform and connected directly to MacroFab’s fully digital, elastic manufacturing platform, Altimade enables customers to request an instant quote and place an order to […]
IC sockets handle smaller-footprint BGA-154b packages
New socket technology addresses newer smaller footprint devices released in the Open NAND Flash Interface (ONFi) 5.0 specification. The Grypper socket is surface-mounted using standard soldering methods to the same location on the PCB. The Grypper requires no lid; the device simply snaps into the socket. Because the Grypper contacts are only 1.5 to 2.2-mm […]
high power density chip resistors save PCB space
TT Electronics announced the debut of its HPDC series high power density chip resistors. This specialist design is optimized for power management, actuator drive, and heating applications which benefit from the enhanced heat transfer from the element to the terminal. The use of such high power density components saves PCB area and boosts reliability by […]
10 straightforward ways to reduce PCB assembly costs without compromising PCB quality
by Ken Ghadia, Sales Engineer, TechnoTronix It is difficult to build a quality product at the lowest cost. The quality of a PCB depends on the competence of its design for assembly, testing, repair, reliability, manufacturing, and yield. Several factors impact the cost of a PCB assembly. However, the designers can consider certain factors that […]
SMT PCB socket offering broadened
Expanding its portfolio of board sockets, Harwin has introduced additional sizes for the popular Sycamore Contact range. These 6A current rated surface-mount PCB sockets allow engineers to accommodate different designs, placing individual sockets freely on a board without the constraint of connector housings. Two additions complement the existing 3.8 7mm length sockets, which accept 0.8-1.3mm […]
Gap filler pads offer performance of 3.2 W/m-K thermal conductivity
Parker Hannifin Corporation announced the launch of THERM-A-GAP PAD 30 and THERM-A-GAP PAD 60, the next generation of thermally conductive gap filler pads from Parker Chomerics. With the performance of 3.2 W/m-K thermal conductivity, THERM-A-GAP PAD 30 reliably conforms to rough surface irregularities and air gaps on heat-generating components. For higher performance applications, THERM-A-GAP PAD […]
