Sarcon GR14B from Fujipoly is a low oil-bleed/specific-gravity gap filler pad material that is offered in sheets or custom shapes to fit your exact application. This material is a candidate for cost-sensitive, lower-power applications that do not require high conductivity. When placed between heat-generating components and a nearby heatsink, this 0.5mm thick, highly conformable gap […]
PCB Design
Thermal interface materials sport low compression force at high compression rates
SARCON PG45A from Fujipoly is one of the industry’s newest high-performance thermal interface materials that exhibits a very low compression force even at high compression rates. This makes the putty-like TIM a great choice for applications that have delicate or wide-variation component heights and require material compression up to 90%. This low modulus thermal gap […]
BGA BGA552 packages get 94-GHz sockets
A new BGA socket design uses a high-performance elastomer capable of 94 GHz, low inductance and wide temperature applications. The GT-BGA-2146 socket is designed for 20.6×19-mm package sizes and operates at bandwidths up to 94 GHz with less than 1 dB of insertion loss. The socket is designed to dissipate 4.5 W using a heat […]
Small-to-large I/O sockets handle BGA chip testing tasks
New Grypper test sockets handle any BGA devices including large array ASICs and the smallest I/O down to 0.35-mm pitch. The Grypper socket can be designed to any I/O count specific to custom BGA requirements. The Ironwood Grypper G80 LIF socket, part number GR1005-XXXX, allows the testing of an 896-I/O, 31.0×31.0-pitch BGA package. This design […]
CAD creepage safety checking aids in power supply PCB design
Zuken announces the launch of the eCADSTAR release 2021.0. With this release, the eCADSTAR 3D PCB design has been extended to include numerous new features, including 3D creepage safety checks in the PCB design editor, improved bus management, and sheet connector cross-references in the schematic editor, and enhanced scripting in the COM interface. The new […]
Multi-directional spring contacts offer board flexibility when needed
Always providing highly inventive engineering solutions, Harwin has now expanded its range of spring contacts with the addition of two further versions. These new surface mount components are capable of supporting both horizontal and vertical connection orientations, but come in smaller size formats than were previously available. The S1961-46R has a 3.55 mm height, while […]
Electronics design search engine integrates PCB software
SnapEDA and DipTrace, an easy-to-use PCB design software, are announcing a new collaboration that introduces support for DipTrace on the SnapEDA website, and integrates SnapEDA’s massive computer-aided design (CAD) database directly into DipTrace’s latest PCB design software. With billions of electronic components to choose from, engineers are faced with multiple challenges during the component selection […]
Half-bridge automotive MOSFETs offered space-saving LFPAK56D package
Nexperia announced a series of half-bridge (high side & low side) automotive MOSFETs constructed in the space-saving LFPAK56D package format. The half-bridge configuration of two MOSFETS is a standard building block for many automotive applications including motor drives and DC/DC converters. The new package provides a half-bridge solution in one device, occupying 30% lower PCB […]
Putty-like thermal interface material delivers high conductivity
SARCON PG80B is high-performance putty-like thermal interface material. This extremely compressible gap filler delivers a thermal conductivity of 8.0 W/m°K with a thermal resistance as low as 0.05°C•in2/W at 43.5 PSI. SARCON PG80B requires a very low compression force, even under high compression rates, to make reliable contact between heat-generating components and nearby heatsinks. This […]
PCB design tool integrated utilities for search and place symbols, footprints, and 3D models
ExpressPCB is excited to announce the release of its new Plus PCB Design Suite (ExpressSCH Plus and ExpressPCB Plus version 3.0). Highlights of the newly added features include an integrated search and download for components using SnapEDA, a schematic link between ExpressSCH Plus and ExpressPCB Plus, as well as netlist validation between the printed circuit […]