Mentor, a Siemens business, today announced certification for TSMC’s 7nm FinFET Plus and the latest version of 5nm FinFET processes for its Mentor Calibre nmPlatform and Analog FastSPICE (AFS) Platforms. In addition, Mentor continues to expand features of both the Xpedition Package Designer and Xpedition Substrate Integrator products supporting TSMC’s advanced packaging offerings. Mentor Calibre nmPlatform for TSMC 5nm and 7nm FinFET Plus […]
Designers who have traditionally used Microchip’s PIC microcontrollers (MCUs) and developed with the MPLAB ecosystem can now easily evaluate and incorporate AVR MCUs into their applications. The majority of AVR MCUs are now beta supported with the release of MPLAB X Integrated Development Environment (IDE) version 5.05, available today from Microchip Technology Inc. Support for additional […]
Symmetry Electronics, a global distributor of wireless, IoT and video technologies, today announced the available distribution of DSP Group’s HDClear 3-Mic Development Kit for Amazon Alexa Voice Service (AVS). The HDClear 3-Mic Development Kit for Amazon AVS enables OEMs to integrate Amazon Alexa into a number of IoT products, including smart speakers, smart home devices, wearable devices, […]
Version 2017.09 of the Synopsys RSoft product portfolio software tools for photonic component and optical communication system design includes important new features to streamline and enhance photonic and optoelectronic modeling. The RSoft Photonic Component Design Suite reduces development time with efficient analysis of silicon photonics components at the device, circuit and system levels. The RSoft Photonic System […]
Premier Farnell, The Development Distributor, is partnering with Traceparts to provide CAD designs for 10,000 TE Connectivity products available to customers to download in multiple formats. Content provided within the library includes high-resolution images, technical documentation, attribution, features and benefits along with descriptions to assist customers with their design selection. Downloadable CAD files in multiple […]
Valor NPI [New Product Introduction] design-for-manufacturing (DFM) technology is said to automate printed circuit board design reviews based on the PCB technology and manufacturing processes employed. Unlike traditional DFM methods that limited the use of DFM technology to subject-matter experts, the new Valor NPI is said to let designers benefit from DFM without having to […]
Silex Technology America, Inc., a global leader in wired and wireless networking solutions, today introduced its newest embedded Wi-Fi solution, the SX-SDPAC SDIO System-in-Package (SiP). This dual-band 1×1 802.11a/b/g/n/ac plus Bluetooth 4.1+HS “Smart Ready” SiP is based on the latest Qualcomm Atheros QCA9377 System-on-Chip (SoC). It offers cost effective, small form factor, and low power Wi-Fi+BT connectivity […]
Engineer (and SPCA advocate) Santiago Gutierrez was looking for a way to exercise his dog while Santiago worked long hours as an engineer at a semiconductor company. Since he couldn’t find anything, he invented something — the GoBone — and started PulsePet. This electronic “smartbone” incorporates algorithms that learn about your dog’s specific play patterns, […]
A new vibration and acceleration simulation package for printed circuit board (PCB) systems is said to accurately predict results ordinarily available only through traditional, physical HALT (highly accelerated lifecycle testing). The Mentor Graphics Xpedition product is said to augment mechanical analysis and physical testing by introducing virtual accelerated lifecycle testing much earlier in the design […]
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Synopsys has announced the availability of the industry’s first verification IP (VIP) and UVM source code test suite to support the USB Power Delivery 3.0 standard. With the increase…
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