IAR Systems announces an update of its static code analysis tool C-STAT, an add-on product completely integrated in the complete C/C++ compiler and debugger toolchain IAR Embedded Workbench. The latest version of C-STAT adds coverage for MISRA C:2012 Amendment 1. C-STAT performs advanced code analysis to find potential issues. The analysis provides code alignment with […]
Software
Software platform speeds development of time-critical/resource-constrained apps at the IoT edge.
IOTech announced the general availability of Edge XRT, a new software platform for time-critical and resource-constrained applications at the IoT Edge. Edge XRT greatly simplifies the development of time-critical IoT systems at the Edge and enables application portability, improved supportability, and faster time-to-market for new IoT edge applications. XRT runs on commodity hardware, independent of […]
Software tool predicts likelihood of bugs in source code
Altran announced the release of a new tool available on GitHub that predicts the likelihood of bugs in source code created by developers early in the software development process. By applying machine learning (ML) to historical data, the tool – called “Code Defect AI” – identifies areas of the code that are potentially buggy and then suggests […]
EDA, Spice software supports TSMC 7-nm FinFET Plus, 5-nm FinFET processes
Mentor, a Siemens business, today announced certification for TSMC’s 7nm FinFET Plus and the latest version of 5nm FinFET processes for its Mentor Calibre nmPlatform and Analog FastSPICE (AFS) Platforms. In addition, Mentor continues to expand features of both the Xpedition Package Designer and Xpedition Substrate Integrator products supporting TSMC’s advanced packaging offerings. Mentor Calibre nmPlatform for TSMC 5nm and 7nm FinFET Plus […]
PIC IDEs now support AVR MCUs
Designers who have traditionally used Microchip’s PIC microcontrollers (MCUs) and developed with the MPLAB ecosystem can now easily evaluate and incorporate AVR MCUs into their applications. The majority of AVR MCUs are now beta supported with the release of MPLAB X Integrated Development Environment (IDE) version 5.05, available today from Microchip Technology Inc. Support for additional […]
“Alexa, get me an SDK”
Symmetry Electronics, a global distributor of wireless, IoT and video technologies, today announced the available distribution of DSP Group’s HDClear 3-Mic Development Kit for Amazon Alexa Voice Service (AVS). The HDClear 3-Mic Development Kit for Amazon AVS enables OEMs to integrate Amazon Alexa into a number of IoT products, including smart speakers, smart home devices, wearable devices, […]
Software models multi-level photonic IC designs
Version 2017.09 of the Synopsys RSoft product portfolio software tools for photonic component and optical communication system design includes important new features to streamline and enhance photonic and optoelectronic modeling. The RSoft Photonic Component Design Suite reduces development time with efficient analysis of silicon photonics components at the device, circuit and system levels. The RSoft Photonic System […]
Premier Farnell launches free CAD library
Premier Farnell, The Development Distributor, is partnering with Traceparts to provide CAD designs for 10,000 TE Connectivity products available to customers to download in multiple formats. Content provided within the library includes high-resolution images, technical documentation, attribution, features and benefits along with descriptions to assist customers with their design selection. Downloadable CAD files in multiple […]
Automated printed PCB design-for-manufacturing flow replaces traditional, manual error-prone processes
Valor NPI [New Product Introduction] design-for-manufacturing (DFM) technology is said to automate printed circuit board design reviews based on the PCB technology and manufacturing processes employed. Unlike traditional DFM methods that limited the use of DFM technology to subject-matter experts, the new Valor NPI is said to let designers benefit from DFM without having to […]
WiFi SiP handles dual-band 1×1 802.11a/b/g/n/ac plus Bluetooth 4.1+HS “Smart Ready”
Silex Technology America, Inc., a global leader in wired and wireless networking solutions, today introduced its newest embedded Wi-Fi solution, the SX-SDPAC SDIO System-in-Package (SiP). This dual-band 1×1 802.11a/b/g/n/ac plus Bluetooth 4.1+HS “Smart Ready” SiP is based on the latest Qualcomm Atheros QCA9377 System-on-Chip (SoC). It offers cost effective, small form factor, and low power Wi-Fi+BT connectivity […]
