Edge Rate high-speed, high-bandwidth interconnect systems save space on PCBs, and are designed for high-cycle, rugged applications. With some connectors, the mating edge of the contact is the cut edge of the pin. If you look at the edge of the pin under a microscope you may see micro burrs and edges. This reduces the […]
GPIB port expander enables peripheral I2C interface and level shifting
Diodes Incorporated announced the PI4IOE5V6416 16-bit I/O expander, which enables any digital device to be accessed and controlled over an I2C interface, across a range of input and output voltages from 1.8V to 5V. The PI4IOE5V6416 offers an ultra-low power solution to expanding the available GPIO on a microprocessor, microcontroller, ASSP, ASIC, or FPGA, using […]
Harwin establishes Academy for aspiring young engineers
Always looking to support upcoming generations of engineering talent, Harwin has announced the founding of its Harwin Academy. This new venture, which has been undertaken in partnership with Havant & South Downs College, has the objective of giving high-quality training to students — thereby opening up career paths for them within the burgeoning STEM sector. […]
Multigig RT 3 backplane connector exceeds 25 Gb/sec
TE Connectivity (TE), Harrisburg, Pa., has launched its fastest rugged backplane connector, the MULTIGIG RT 3 connector. TE’s MULTIGIG RT 3 connectors support speeds of 25-plus Gb/sec, making them among the fastest rugged backplane connectors for embedded computing or VPX systems currently on the market. The ruggedized design makes these connectors ideally suited to withstand […]
MDC duplex optical connector offers high density for two-fiber connectivity
US Conec, Hickory, N,.C., has unveiled its new duplex optical connector solution: the MDC connector. This state-of-the-art connector design ushers in a new era in two fiber connectivity by bringing unmatched density, simple insertion/extraction, field configurability and optimal carrier grade performance to the ELiMENT brand single fiber connector portfolio. The MDC is a two-fiber connector […]
Central Semiconductor’s Industrial solutions solve toughest challenges
A new solution service called Super Industrial features devices designed to meet the harshest environmental concerns experienced by designers of endproducts used in adverse conditions. Whether products are used in moisture-sensitive environments or extreme temperatures, Super Industrial™ discrete semiconductors will overcome these challenges. Utilizing Central Semiconductor’s unique custom device development process, Super Industrial discretes start […]
Gain blocks extend the performance of space-qualified InGaP amplifier technology to the X-band
Teledyne e2v HiRel, part of the Teledyne Defense Electronics Group, announces the availability of the new 14 GHz family of RF gain blocks spearheaded by an 18.4 dB amplifier (TDGB014-003). The Gain Blocks are based on an indium gallium phosphide (InGaP) technology that is suitable for use in aerospace and defense applications because of its ceramic […]
Stamped-spring pin socket for 1-mm-pitch Mobility Radeon 9000
A new socket addressing high-performance requirements for Burn-in and Test applications is called the SBT-BGA-6558. The contactor is a stamped-spring pin with 31-g actuation force per ball and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss is less than 1 dB at 15.7 GHz, and capacitance 0.097 pF. […]
Via-in-pad guidelines for PCBs
Duane Benson, Chief Technology Champion at Screaming Circuits Via in pad seems to be one of the hot topics these days. It’s a bit of a tough one too. The SMT guys pretty much always say, “don’t ever do it.” However, with certain parts, the component manufacturer strongly recommends it. You gotta love those mutually […]
LED & diode markation guidelines for PCBs
Duane Benson, Chief Technology Champion, Screaming Circuits Have you ever had an LED or other diode placed backwards? PCB assemblers work hard to place every component, from the largest, highest pin-count logic chip, down to the smallest passive components and micro wafer scale BGAs, correctly every single time. A key element of that accuracy is […]
- 1
- 2
- 3
- …
- 9
- Next Page »
@eeworldonline
EE World Online
YouTube
Instagram