• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar
  • Skip to footer

Electrical Engineering News and Products

Electronics Engineering Resources, Articles, Forums, Tear Down Videos and Technical Electronics How-To's

  • Products / Components
    • Analog ICs
    • Battery Power
    • Connectors
    • Microcontrollers
    • Power Electronics
    • Sensors
    • Test and Measurement
    • Wire / Cable
  • Applications
    • 5G
    • Automotive/Transportation
    • EV Engineering
    • Industrial
    • IoT
    • Medical
    • Telecommunications
    • Wearables
    • Wireless
  • Learn
    • eBooks / Handbooks
    • EE Training Days
    • Tutorials
    • Learning Center
    • Tech Toolboxes
    • Webinars & Digital Events
  • Resources
    • White Papers
    • Design Guide Library
    • Digital Issues
    • Engineering Diversity & Inclusion
    • LEAP Awards
    • Podcasts
    • DesignFast
  • Videos
    • EE Videos and Interviews
    • Teardown Videos
  • EE Forums
    • EDABoard.com
    • Electro-Tech-Online.com
  • Bill’s Blogs
  • Advertise
  • Subscribe

CommScope submits competitive bid for Andrew Corp.

August 7, 2006 By Jeff Baumgartner, CED

CommScope has placed a rival bid for Andrew Corp., claiming its offer represents a 36 percent premium over an earlier offer made by ADC in late May.

CommScope said its offer, at $9.50 per share, is valued at $1.7 billion in cash. It said the ADC per share value to Andrew shareholders would be $6.97, based on the closing price of ADC shares on Aug. 4, 2006.

The competing bid caused Andrew shares to surge 22.69 percent to $9.68 apiece in mid-day trading Monday.

CommScope noted that its proposal is a 20 percent premium over the $7.89 closing price of Andrew’s shares on Aug. 4. Its offer also includes the assumption of about $186 million in Andrew net debt.

CommScope said its proposal will expire on Friday, Aug. 11, 2006, at 5 p.m. Eastern.

“We are going to be evaluating the offer from CommScope that we just received this morning, and we will respond at the appropriate time,” an Andrew spokesman said.

ADC officials were not available for comment by Monday’s deadline.

CommScope Chairman & CEO Frank Drendel, in a letter to Andrew Corp. President  Ralph Faison, called his company’s proposed deal “a compelling strategic fit that will build upon Andrew’s and CommScope’s highly complementary operating assets.

“We believe our proposal is superior both financially and strategically, to the offer contemplated in your merger agreement with ADC Telecommunications Inc.”

CommScope specializes in “last mile” cable and connectivity equipment, and is the world’s largest manufacturer of coax for hybrid/fiber coax systems. It has also widened its portfolio in recent years with products that extend HFC plant wirelessly. Andrew, which reported sales of $1.9 billion last year, manufactures and supplies a wide range of communications equipment, including gear for wireless, land mobile radar, cellular, broadcast and radar applications.

CommScope, based on a review of publicly available information, claimed a combination with Andrews would generate annual cost savings of $30 to $50 million in the first full year after the deal is closed, and hit $70 million to $90 million in the second.

You Might Also Like

Filed Under: Uncategorized

Primary Sidebar

EE Engineering Training Days

engineering

Featured Contributions

Five challenges for developing next-generation ADAS and autonomous vehicles

Robust design for Variable Frequency Drives and starters

Meeting demand for hidden wearables via Schottky rectifiers

GaN reliability milestones break through the silicon ceiling

From extreme to mainstream: how industrial connectors are evolving to meet today’s harsh demands

More Featured Contributions

EE Tech Toolbox

“ee
Tech Toolbox: 5G Technology
This Tech Toolbox covers the basics of 5G technology plus a story about how engineers designed and built a prototype DSL router mostly from old cellphone parts. Download this first 5G/wired/wireless communications Tech Toolbox to learn more!

EE Learning Center

EE Learning Center
“ee
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.
“bills
contribute

R&D World Podcasts

R&D 100 Episode 10
See More >

Sponsored Content

Advanced Embedded Systems Debug with Jitter and Real-Time Eye Analysis

Connectors Enabling the Evolution of AR/VR/MR Devices

Award-Winning Thermal Management for 5G Designs

Making Rugged and Reliable Connections

Omron’s systematic approach to a better PCB connector

Looking for an Excellent Resource on RF & Microwave Power Measurements? Read This eBook

More Sponsored Content >>

RSS Current EDABoard.com discussions

  • Mean offset increase in post-layout simulation of clocked comparator
  • problem connecting to my xilinx device VIA global IP
  • Testing 5kW Grid Tied inverter over 200-253VAC
  • Getting different output for op amp circuit
  • dc-dc converter in series

RSS Current Electro-Tech-Online.com Discussions

  • Back to the old BASIC days
  • using a RTC in SF basic
  • what's it's name
  • What is correct names for GOOD user friendly circuit drawing program?
  • Curved lines in PCB design
Search Millions of Parts from Thousands of Suppliers.

Search Now!
design fast globle

Footer

EE World Online

EE WORLD ONLINE NETWORK

  • 5G Technology World
  • Analog IC Tips
  • Battery Power Tips
  • Connector Tips
  • DesignFast
  • EDABoard Forums
  • Electro-Tech-Online Forums
  • Engineer's Garage
  • EV Engineering
  • Microcontroller Tips
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips

EE WORLD ONLINE

  • Subscribe to our newsletter
  • Teardown Videos
  • Advertise with us
  • Contact us
  • About Us

Copyright © 2025 · WTWH Media LLC and its licensors. All rights reserved.
The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media.

Privacy Policy