Intrinsyc Technologies Corporation announced the Open-Q 845 µSOM (micro System on Module) and Development Kit, to be available in the fourth quarter of 2019.

The Open-Q 845 µSOM is the latest product in the evolution of Intrinsyc’s µSOM computing module series. It is an ultra-compact (50mm x 25mm), production-ready embedded module, ideal for powering the most advanced robotics, drones, cameras, and embedded IoT devices requiring the latest on-device AI powers. Featuring the Qualcomm SDA845 system on chip (SoC) from Qualcomm Technologies, Inc., the 845 µSOM integrates many new features and capabilities in the same small form-factor:

• Higher performing Octa-core CPU – up to 2.6GHz on Gold cores
• New hardware-based security layers for vault-like defense
• Third generation Qualcomm AI platform for immersive, on-device intelligence
• Four camera ports with flexible configurations supports up to 7 cameras
• New camera architecture for cinema-grade video capture
• DisplayPort 4K60 via USB Type-C with USB super-speed data concurrency
• Additional USB3.1 port for device connectivity while using DisplayPort
• Gen3 PCIe interface.

This new hardware platform will be supported by your choice of full-featured Android 9 or Yocto Linux operating systems, with plans for offering Android 10 by Q2 next year. The Android 9 operating system will be shipped on the development kit and is an ideal starting point for evaluation of the SOM and to kick-start your product development. If you prefer a Linux OS, that will be available to download from Intrinsyc and program onto your development kit. Full software documentation will also be included with purchase of the development kit.

Key specifications:

• Qualcomm SDA845 SoC built on 2nd-Gen 10nm technology:
  • Qualcomm Kryo 385 Octa-core CPU
  • Qualcomm Adreno 630 Visual Processing Subsystem
  • Qualcomm Spectra 280 Image Signal Processor
  • Qualcomm Hexagon 685 DSP
  • Qualcomm Secure Processing Unit
  • Third Generation Qualcomm Artificial Intelligence Engine for on-device intelligence
• System Memory: 4GB or 6GB LPDDR4x RAM (POP) + 32GB or 64GB UFS flash storage
• Wireless Connectivity: Wi-Fi 802.11a/b/g/n/ac 2.4/5Ghz 2×2 MU-MIMO + Bluetooth 5.x
• Display Interfaces:
  • DisplayPort v1.4 on USB Type-C, up to 4K60 with USB data concurrency
  • 2x MIPI 4-lane DSI up to 4K 10-bit 60fps
• Camera Interfaces:
  • 4 Cameras: 3x 4-lane MIPI CSI + 1x 2-lane MIPI CSI camera ports
  • Dual 16MP ISP + ISP-lite 2MP
• Video Performance:
  • Encode: 4K60 H.264/H.265, 4K30 for VP8
  • Decode: 4K60 H.264/H.265/VP9
• Audio Interfaces:
  • Dedicated Audio DSP supporting Qualcomm® WCD9340 audio codec (off-SOM)
  • SLIMBus or multi-channel I2S digital audio interfaces
• I/O Interfaces:
  • 2x USB3.1, one with Type-C/DisplayPort support
  • 1x USB2.0 micro-B debug UART
  • 1x SDIO 4-bit interface
  • 1x PCIe Gen3 1-lane interface
• Power: Integrated power and battery management on SOM
• Size: 25mm x 50mm
• Operating System: Android 9, Linux