The 28nm process is the most advanced process used for manufacturing OLED DDICs today. MagnaChip’s new 28nm OLED DDIC achieves a form factor reduction that is 20 percent smaller than that of the previous 40nm process and is suitable for smartphones and other mobile devices, where small size and thinness are critical factors. In addition, MagnaChip reduced the logic voltage from 1.1V, which was required for the existing 40nm products, to 1.0V, which reduces the current voltage consumption by more than 20 percent and also extends battery life. MagnaChip’s latest 28nm OLED DDIC provides Best-In-Class performance, power and feature with high performance/price value.
With the addition of this new 28nm platform OLED DDIC, MagnaChip now has developed a portfolio of nine advanced platform OLED Display Driver ICs, including one 110nm rigid bezel-less, two 55nm flexible bezel-less and five 40nm rigid bezel-less OLED DDICs. MagnaChip’s product roadmap includes plans to expand the feature set of OLED DDICs to include Ultra-High-Definition (UHD) capabilities.
The 28nm OLED display driver IC also is expected to improve the call quality of smartphones by reducing EMI (Electromagnetic Interference) levels by 20 percent, as compared to existing products based on the 40nm format. The 28nm new OLED driver IC supports various display types such as rigid, flexible, foldable and VR, AR applications. It also maximizes design flexibility for latest full-screen displays, such as bezel-less, hole type displays. This new display driver already has won its first design-in at a leading smartphone manufacturer.