Efficient Power Conversion Corporation, the world’s leader in enhancement-mode gallium nitride on silicon (eGaN) power FETs and ICs announces the EPC2111, 30 V enhancement-mode monolithic GaN transistor half bridge. By integrating two eGaN® power FETs into a single device, interconnect inductances and the interstitial space needed on the PCB are eliminated. This increases both efficiency (especially at higher frequencies) and power density, while reducing assembly costs to the end user’s power conversion system.The EPC2111 is ideal for high frequency 12 V to point-of-load DC-DC conversion.

Each device within the EPC2111 half-bridge component has a voltage rating of 30 V. The upper FET has a typical RDS(on) of 14 mΩ, and the lower FET has a typical RDS(on) of 6 mΩ. The EPC2111 comes in a chip-scale package for improved switching speed and thermal performance, and is only 3.5 mm x 1.5 mm for increased power density.

A primary application for this device is for notebook and tablet computing. The power conversion circuitry in these systems occupy nearly half of the space and define the height of the motherboard. The high-frequency capability of GaN reduces the size required for power conversion and thus will drive significant size reductions of next generation mobile computing.