I thought I heard about 100 different languages spoken as I crisscrossed 17 halls over four days in Munich at electronica 2018 with an average of eight miles a day of walking. I was wrong. It was closer to 180 languages.
Tens of thousands of attendees were laser-focused on simplifying design and integrating devices and systems. And the 3100 exhibitors were there to present just that engineering trifecta.
Look for my personal show wrap-up next week. In the meantime, check out these announcements from some of the companies across The Board at electronica 2018 last week:
GaN Systems to demonstrate size, weight, power, and system cost benefits of GaN at electronica 2018
Intelligent Power Modules for on-board charging 40% smaller than discrete options
Lead-free high-voltage resistors future-proof medical and industrial designs
LoRa SiP includes 32-bit MCU, LoRa transceiver and software stack
1.7 kV SiC power module optimized for high-reliability industrial apps
Bluetooth 5.0 long range-compliant RF module comes in miniature SIP package
12:1-input quarter-brick dc/dc converters key on railway apps
Single-chip CMOS 60-GHz sensors include antenna-on-package features
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