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electronica 2018: Get smart, Get small, Get integrated

November 19, 2018 By Aimee Kalnoskas Leave a Comment

I thought I heard about 100 different languages spoken as I crisscrossed 17 halls over four days in Munich at electronica 2018 with an average of eight miles a day of walking. I was wrong. It was closer to 180 languages.

Tens of thousands of attendees were laser-focused on simplifying design and integrating devices and systems. And the 3100 exhibitors were there to present just that engineering trifecta.

Look for my personal show wrap-up next week. In the meantime, check out these announcements from some of the companies across The Board at electronica 2018 last week:

GaN Systems to demonstrate size, weight, power, and system cost benefits of GaN at electronica 2018

Intelligent Power Modules for on-board charging 40% smaller than discrete options

Reference design covers biometric payment cards

Lead-free high-voltage resistors future-proof medical and industrial designs

LoRa SiP includes 32-bit MCU, LoRa transceiver and software stack

1.7 kV SiC power module optimized for high-reliability industrial apps

Targeted connectivity solutions for IIoT at electronica

USB Type-C/PD controller IC enables 3-A current delivery

Bluetooth 5.0 long range-compliant RF module comes in miniature SIP package

12:1-input quarter-brick dc/dc converters key on railway apps

Single-chip CMOS 60-GHz sensors include antenna-on-package features

 

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Filed Under: Analog ICs, Featured Tagged With: electronica2018, ftdichip, gansystemsinc, insightsip, microchiptechnologyinc, recom, rohm, texasinstrumentsinc, ttelectronics

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