A new BGA socket addresses high-performance requirements for Multi-Chip Memory Packages In the CBT-BGA-6073, the contactor is a stamped spring pin with 31-gram actuation force per ball and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss is < 1 dB at 15.7 GHz, and contact resistance is < 30 mΩ. The current capacity of each contactor is 4 A at 60°C temperature rise. Socket temperature range is -55 to +180°C.
The socket also features a floating guide for precise ball-to-pin alignment. The specific configuration of the package to be tested in the CBT-BGA-6073 is a BGA, 20×15-mm, 0.8-mm pitch, 252-position, 23×17 ball array. The socket is mounted using supplied hardware on the target PCB with no soldering and uses the smallest footprint for nearby passive components. The socket uses a five-post stiffener plate to support the back side of the PCB and allows passive components to be placed in between posts.
This socket utilizes clamshell lid with integrated compression mechanism. The socket is constructed with a cam-actuated lever lid with central opening for direct thermal characterization of silicon. To use, place the device inside the socket, close the clamshell lid by latching and apply downward pressure by turning the lever. This socket can be used for hand test and temperature characterization as well as debugging applications in development and MCP comparison between various manufacturers.
Pricing for the CBT-BGA-6073 is $972 at qty one with reduced pricing available depending on quantity required.
Ironwood Electronics, 1335 Eagandale Ct., Eagan, MN 55121, 800-404-0204, www.ironwoodelectronics.com
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